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A kind of display panel and packaging method thereof, oled device

A technology for display panels and packaging methods, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve the problems of affecting the packaging effect and liquid filling overflow, so as to improve the service life, reduce the climbing ability, and reduce the intrusion of water and oxygen. The effect of the risk

Active Publication Date: 2020-11-03
BOE TECH GRP CO LTD +1
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a display panel, its packaging method, and an OLED device, which can solve the problem in the prior art that the liquid filling material overflows due to the climbing phenomenon of the liquid filling material before curing, thereby affecting the packaging effect.

Method used

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  • A kind of display panel and packaging method thereof, oled device
  • A kind of display panel and packaging method thereof, oled device
  • A kind of display panel and packaging method thereof, oled device

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] An embodiment of the present invention provides a display panel, such as Figure 2 to Figure 6 As shown, it includes: the first substrate 12 provided with the component to be packaged 11; the barrier wall 13 arranged on the first substrate 12, the barrier wall 13 is ring-shaped and arranged on the periphery of the component to be packaged 11; the inner surface of the barrier wall 13 and the The included angle α between the upper surfaces of the first su...

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Abstract

Embodiments of the present invention provide a display panel, a packaging method thereof, and an OLED device, which relate to the field of display manufacturing and can solve the problem of overflow of liquid fillers caused by the climbing phenomenon of liquid fillers before curing in the prior art, thereby affecting The problem of encapsulation effect. The display panel includes: a first substrate provided with a component to be packaged; a barrier wall arranged on the first substrate, and the barrier wall is annularly arranged on the periphery of the component to be packaged; the inner surface of the barrier wall and the upper surface of the first substrate The included angle between them is an acute angle; filling in the area enclosed by the barrier wall, the filling is formed by a curable hydrophobic liquid. The invention is used for packaging of display panels.

Description

technical field [0001] The invention relates to the field of display manufacturing, in particular to a display panel, a packaging method thereof, and an OLED device. Background technique [0002] Organic Light Emitting Device (OLED) is a display lighting device that has been gradually developed in recent years. Due to its advantages of high response, high contrast, and flexibility, it is considered to have broad application prospects. However, since the OLED device will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to select a better packaging method for the OLED device. [0003] At present, Dam+Filler (retaining wall + filler) packaging is a packaging method widely used in the production of OLED displays. refer to figure 1 As shown, a retaining wall 03 is provided on the substrate 02 provided with the OLED main structure 01, and the retaining wall 03 surrounds the OLED main structure 01 in a ring shape, and then the surro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52
CPCH10K59/873H10K59/8722H10K71/40H10K50/8428H10K50/844H10K50/8426H10K71/00
Inventor 蒋志亮王世龙
Owner BOE TECH GRP CO LTD
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