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Detection method for curing degree of glue

A glue curing and detection method technology, applied in the direction of measuring devices, strength characteristics, test material hardness, etc., can solve the problems of glue encroaching on the chip, bad, and not conducive to the prevention of quality hidden dangers, etc., to achieve low risk of misjudgment and strong practicability Effect

Inactive Publication Date: 2018-07-27
HITECH SEMICON WUXI
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AI Technical Summary

Problems solved by technology

[0003] Glue is widely used in the semiconductor packaging process, but the current detection of the semi-cured degree of the glue depends on the shape of the glue after the wafer pasting operation for judgment. When abnormalities are found, a large number of defective products have been produced, and relevant technical personnel are required to have enough experience support
Insufficient and excessive curing of the glue will cause the glue to invade the chip and air bubbles respectively, resulting in defective products, which is not conducive to preventing quality hazards

Method used

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  • Detection method for curing degree of glue
  • Detection method for curing degree of glue
  • Detection method for curing degree of glue

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Embodiment Construction

[0031] The utility model will be described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present invention.

[0032] The invention provides a method for detecting the curing degree of glue,

[0033] Including providing A-type Shore hardness tester, semi-cured glue samples;

[0034] The semi-cured glue sample includes glue 1, chip 2, and substrate 3; glue 1 is between chip 2 and substrate 3, and connects both ends of chip 2 to substrate 3;

[0035] Step 1, place the semi-cured glue sample on a solid plane;

[0036] Step 2, A-type Shore hardness tester indents to the edge;

[0037] Step 3, press the presser foot in parallel on the surface of the semi-cured glue sample;

[0038] Step 4, press the needle vertically into the sample;

[0039] Step 5, take a reading immediately after pressing down;

[0040] Step 6, according to t...

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Abstract

The invention provides a detection method for the curing degree of glue. The method aims to overcome the problem that detection of the semi-curing degree of glue in semiconductor packaging relies on naked eyes and experience in the prior art. The detection method comprises the following steps: providing an A type Shore durometer and a semi-cured glue sample; placing the semi-cured glue sample ontoa firm plane; allowing the indenter of the A type Shore durometer to move to the edge; parallely and downwardly pressing pressure feet onto the surface of the semi-cured glue sample; vertically pressing the indenter into the sample; immediately carrying out reading after completion of downward pressing; and carrying out measurement according to the hardening degree of glue so as to obtain hardness values and determining whether the sample has hidden quality troubles in reference to grades corresponding to different hardness ranges.

Description

technical field [0001] The invention relates to a method for detecting glue solidification, in particular to a method for detecting glue solidification during wafer pasting. Background technique [0002] A Chinese utility model patent has been published, publication number: CN102496586A, patent name: method for detecting photoresist defects, application date: 20111124, which discloses a method for detecting photoresist defects, including: providing a semiconductor wafer, coating Photoresist; carry out pre-measurement on the photoresist, count the number of defects, and obtain the previous value; bake the semiconductor wafer coated with photoresist according to the reference time and reference temperature parameters; Carrying out post-testing, counting the number of defects, and obtaining the post-value; comparing the pre-value and post-value to determine whether the photoresist is qualified. The reference time and reference temperature are determined by parameter determinat...

Claims

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Application Information

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IPC IPC(8): G01N3/42
CPCG01N3/42G01N2203/0076
Inventor 戴海亮汤剑波王家松张伟
Owner HITECH SEMICON WUXI
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