Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer biscuit baking oven

A wafer and oven technology, which is used in food ovens, ovens loading/unloading, baking, etc. The effect of saving gas, balanced color and low maintenance cost

Inactive Publication Date: 2018-07-27
肇庆市万顺达食品机械制造有限公司
View PDF9 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The equipment for baking and forming wafer slices is not specially designed for the baking and forming of wafer slices, so that it does not fully match the requirements for baking and forming wafers. The energy-saving effect is not obvious, and the operation is inconvenient. Unstable machine operation and other shortcomings

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer biscuit baking oven
  • Wafer biscuit baking oven
  • Wafer biscuit baking oven

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039]In order to further illustrate the technical means and functions adopted by the present invention to achieve the intended purpose, the specific implementation modes of the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0040] Please refer to figure 1 , the present embodiment provides a wafer oven, comprising a wafer transport chain assembly 1, a number of wafer molds 2 arranged on the wafer transport chain assembly 1, respectively arranged on the wafer transport chain assembly 1 The two gas components 3 at the bottom and the middle, the chassis 4 set at one end of the wafer conveyor chain component 1 and partially wrapping the wafer conveyor chain component 1, the mold opening and closing component 5 set in the chassis 4, and the chassis 4 4, and the discharge joint assembly 7 arranged in the cabinet 4. Through the mutual cooperation of the wafer transport chain assembly 1, wafer mold 2, gas...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a wafer biscuit baking oven. The wafer biscuit baking oven comprises a wafer biscuit conveying chain assembly, a plurality of wafer biscuit molds arranged on the waferbiscuit conveying chain assembly, two fuel gas assemblies respectively arranged on the bottom end and in the middle of the wafer biscuit conveying chain assembly, a machine box arranged at one end ofthe wafer biscuit conveying chain assembly and partially wrapping the wafer biscuit conveying chain assembly, a mold opening and closing assembly arranged in the machine box, a slurry feeding assemblyarranged in the machine box, and a material discharging and slice receiving assembly. The interactions of the wafer biscuit conveying chain assembly, wafer biscuit molds, fuel gas assemblies, mold opening and closing assembly, slurry feeding assembly and material discharging and slice receiving assembly realize an effect of integrally, continuously and synchronously completing automatic baking ofthe wafer biscuit slices; each 90-degree rotation of a left star wheel and a right star wheel can complete the baking of the wafer biscuits; and the wafer biscuit baking oven is simple and convenientin operations, stable in whole machine operation and low in maintenance costs.

Description

technical field [0001] The invention relates to a food processing device, in particular to a wafer oven. Background technique [0002] The equipment for baking and forming wafer slices is not specially designed for the baking and forming of wafer slices, so that it does not fully match the requirements for baking and forming wafers. The energy-saving effect is not obvious, and the operation is inconvenient. Machine operation is unstable and other shortcomings. There is a need for a new equipment for baking and forming wafer slices, which can realize the automatic baking of wafer slices in a coherent and synchronous manner. Contents of the invention [0003] In view of the above deficiencies, the purpose of the present invention is to provide a wafer baking oven, which realizes the automatic baking of wafer slices in one piece, coherently and synchronously. The effect of low maintenance cost. [0004] The technical scheme that the present invention adopts for achieving t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A21B7/00A21B1/33A21B1/48A21B3/07A21B3/18A21C9/08
CPCA21B1/33A21B1/48A21B3/07A21B3/18A21B7/00A21C9/081
Inventor 不公告发明人
Owner 肇庆市万顺达食品机械制造有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com