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Preparation method of display panel, display panel and display device

A display panel and side panel technology, which is applied in printing devices, semiconductor/solid-state device manufacturing, printing, etc., can solve the problems of difficulty in realizing narrow borders and occupying space on the border of display devices, and achieve the effect of realizing narrow border design.

Active Publication Date: 2018-06-29
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for preparing a display panel, a display panel and a display device to solve the problem in the prior art that the binding part occupies the frame space of the display device and it is difficult to realize a narrow frame

Method used

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  • Preparation method of display panel, display panel and display device
  • Preparation method of display panel, display panel and display device
  • Preparation method of display panel, display panel and display device

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] like figure 2 Shown is a flow chart of a method for manufacturing a display panel according to an embodiment of the present invention, and the method includes the following steps:

[0029] Step 100, providing a screen and a display panel body.

[0030] like figure 2 As shown, it is a schematic structural view of the display panel body. The display panel includes a first substrate 11 and a second substrate 12 arranged oppositely. The fir...

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Abstract

The present invention discloses a preparation method of a display panel, a display panel and a display device. The method comprises the steps of: providing a printing screen and a display screen body,wherein the display screen body comprises a first substrate and a second substrate which are arranged in a folding mode, a plurality of metal leads are arranged on the first substrate, a first alignment mark is arranged on the display screen body, and the printing screen comprises a roof and a side plate which form a bending structure, a second alignment mark matching with the first alignment mark is arranged on the roof, and the side plate is provided with a plurality of connection line meshes; performing alignment of the second alignment mark and the first alignment mark; forming a plurality of metal connection lines at the side surface of the display panel body through a silk-screen printing process, wherein the metal connection lines are electrically connected with the metal leads. Therefore, the metal leads electrically connected with the metal leads arranged on the first substrate are arranged at the side surface of the display panel body and cannot occupy a non-display area ofthe display panel body so as to facilitate achieving of the narrow-frame design of the display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a display panel, a display panel and a display device. Background technique [0002] With the development of display technology, the frame of the display device is made narrower and narrower. However, since the side of the array substrate of the display panel is usually provided with a binding part, since the existence of the binding part occupies part of the space of the frame, it is impossible to Some borders are very narrow. [0003] like figure 1 As shown, the display panel includes an array substrate 11' and a color filter substrate 12' arranged oppositely. A binding part 14' is provided on the side of the array substrate 11' beyond the color filter substrate. The binding part 14' is used to connect the flexible circuit The board 3' is electrically connected to the metal lead 111' on the array substrate 11'. Since the binding portion 14 ′ is dispos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/56H01L21/68B41M1/26B41M1/12
CPCH01L21/68B41M1/12B41M1/26H10K59/1275H10K59/131H10K71/50H10K59/1201
Inventor 张玉军刘超
Owner BOE TECH GRP CO LTD
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