An array type intelligent laser drilling mechanism

Abstract

The invention discloses an array-type intelligent laser punching mechanism. According to the array-type intelligent laser punching mechanism, the problem that punching precision is low in the technical operation process of array holes is solved; in the cutting process of thick plates and three-dimensional plates, precise manipulation is achieved, better simplification and intellectualization are achieved, the consumed time and cost are low, and the steps of the operation technique are simplified; especially, a micro-measuring instrument is additionally arranged, the punching process is monitored in real time, and the difficult problems in actual production are solved; the production efficiency is improved, the precision is extremely high, the manufacturing cost is low; and the effect is strengthened significantly, and overall high efficiency and operation reliability are also improved greatly.

Description

technical field [0001] The invention relates to the field of drilling, and more specifically relates to an array type intelligent laser drilling mechanism. Background technique [0002] Laser cutting is a newly emerging subject field integrating optics, machinery, electronics, computer and other disciplines, and it has been more and more widely used in all walks of life. It is a non-contact processing method, which does not have the problem of tool wear and does not pollute the environment at the same time. It is a high-tech "green" processing method worthy of praise. Laser cutting processing is an important field of laser processing. It irradiates the laser beam to the surface of the object, and uses the heat energy or the chemical heat energy generated when the material melts to melt the material to achieve the purpose of cutting and engraving the surface of the object. It has high processing speed and high precision. High, no mechanical force, no deformation of the proce...

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Problems solved by technology

[0003] However, the current three-dimensional laser drilling mechanism only uses one drilling device. When multiple holes are to be drilled on the workpiece, it needs to move in the three-dimensional direction, or even rotate on multiple axes. During each movement of the laser device, There will inevitably be deviations, and the accumulation of multiple deviations will cause very large errors, especially for array holes that require high precision, large errors will lead to the scrapping of the entire workpiece, and the current laser cutting is in progress The automation of industrial production is not very high in the operation of array holes, and it is not possible to operate accurately, especially in the process of curve cutting, which is complicated, poor in quality, time-consuming and high in cost, which can no longer meet the requirements of industrial production. Therefore, in view of this situation , there is an urgent need to develop a new multi-functional array intelligent laser drilling mechanism to meet the needs of practical use

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