A thermal design method for tec selection of radar incubator

Abstract

The invention relates to a thermal design method for TEC type selection of a radar constant temperature box. The invention includes completing the type selection of the semiconductor refrigerator (TEC), fan and radiator in the radar constant temperature box through theoretical calculation; establishing a three-dimensional model of the radar constant temperature box; establishing a three-dimensional gridded calculation domain; and performing simulation calculation on the radar constant temperature box , to obtain the initial simulation results; establish the contour cloud map of temperature distribution and the flow trace of the fluid, and improve the internal structure and layout of the radar incubator that does not meet the working requirements. The invention can shorten the research and development cycle and improve economic benefits. The radar constant temperature box obtained by the design method of the invention not only has good heat dissipation effect, but also has compact structure, miniaturization, waterproof sealing and electromagnetic shielding effect during actual use.

Description

technical field [0001] The invention belongs to the field of thermal simulation design, and in particular relates to a thermal design method for TEC type selection of a radar constant temperature box. Background technique [0002] Thermal design is the thermal design of electronic components. Electronic components in electronic components generally have a temperature range for use, and electronic components generally have a certain amount of heat consumption (calorific value) when they are used. If no measures are taken, electronic components will The ambient temperature inside the device will exceed the allowable temperature range of the electronic components. After exceeding the temperature range of the electronic components, the performance will drop, it will not work until it is burned, and the ambient temperature is too low, and the electronic components will not work properly. Due to the large number of electronic modules in the box, and the development of electronic c...

AI Technical Summary

Problems solved by technology

[0002] Thermal design is the thermal design of electronic components. Electronic components in electronic components generally have a temperature range for use, and electronic components generally have a certain amount of heat consumption (calorific value) when they are used. If no measures are taken, electronic components will The ambient temperature inside the device will exceed the allowable temperature range of electronic components. After exceeding the temperature range of electronic components, there will be performance degradation, failure to work until it is burned, and the ambient temperature is too low, and electronic components cannot work normally.

Due to the large number of electronic modules in the box, and the development of electronic components in the direction of miniaturization and light weight, the volume power density will inevitably increase, making the traditional heat dissipation method unable to meet the miniaturization and light weight requirements of the box field. Can not meet the electromagnetic shielding and waterproof requirements of electronic components

[0003] At present, in the heat dissipation design of low heat consumption (less than 500W) modules, fans are mostly used for forced air cooling. Although the fans are economical and simple in layout, their efficiency is too low. It makes it easy for the fan to bring dust from the outside into the electronic components, which cannot guarantee the sealing and affects the reliability of the electronic components.

In the field of high heat consumption (higher than 500W), most of them use air conditioners and water cooling to dissipate heat. Although the efficiency is high, the cost is expensive and the structure is complicated.

Images