Surface-treated connecting device for modular building

A connection device and surface treatment technology, which is applied in the field of surface treatment of modular building connection devices, can solve problems such as damage to the surface treatment layer of steel materials, damage to the interface of the contact surface, and failure to put it on the market, so as to reduce water absorption and increase crosslinking degree, strong adhesion effect

Inactive Publication Date: 2018-03-23
BOCA HI TECH PRECISION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Steel is the main raw material for preparing modular building connection devices. It is more convenient to process and weld, and it also has a certain anti-rust function. The anti-rust ability itself has limitations, mainly because the contact between the two components will damage the surface treatment layer of the steel. For example, when it is installed or slightly shaken and rubbed after installation, it will cause interface damage to the contact surface.
However, the existing steel manufacturers do not have the ability to carry out surface treatment to meet the requirements of modular buildings, and the manufacturers specializing in surface treatment lack the knowledge of mechanical structures. If higher-level raw materials are used, the cost will be too high. Therefore, it is necessary to develop a new surface treatment method suitable for quick connection devices between high-strength modular components, especially for exposed contact surfaces, which need to have very good rust resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Mix 210g of acrylic acid, 100g of N-methylolacrylamide, 50g of 1,4-cyclohexanedimethanol diacrylate, 240g of N-vinylpyrrolidone, 180g of lauryl methacrylate, and 250g of isomeric tridecyl alcohol polyoxyethylene Add ether and 150g resorcinol monobenzoate to 1000g water, stir for 30 minutes, then add 100mL of 0.1g / mL potassium persulfate aqueous solution dropwise, the dropwise addition is completed within 20 minutes, and react at 75°C for 1.5 hours to obtain a prepolymer ;

[0024] (2) Dissolve 110g of 4,4'-bistrifluoromethoxyazobenzene and 0.1g of dicumyl peroxide into 400g of N,N-dimethylformamide, then add 1000g of tetraglycidyl ether tetraphenyl Diethyl ethane, after stirring for 30 minutes, add 280g lauryl methacrylate and 280g maleic anhydride, react at 95°C for 2 hours, then add 50g 4-dimethylaminopyridine, and continue the reaction for 1 hour to obtain an adhesive;

[0025] (3) Add 1000g of hydroxyl silicone resin, 1g of dimethylimidazole, and 50g of solid a...

Embodiment 2

[0029] (1) Mix 250g of acrylic acid, 150g of N-methylolacrylamide, 80g of 1,4-cyclohexanedimethanol diacrylate, 260g of N-vinylpyrrolidone, 190g of lauryl methacrylate, and 280g of isomeric tridecyl alcohol polyoxyethylene Add ether and 180g resorcinol monobenzoate to 1000g water, stir for 30 minutes and then add 110mL of 0.1g / mL potassium persulfate aqueous solution dropwise, the dropwise addition is completed within 30 minutes, and react at 75°C for 2.5 hours to obtain a prepolymer ;

[0030] (2) Dissolve 150g of 4,4'-bistrifluoromethoxyazobenzene and 0.15g of dicumyl peroxide into 400g of N,N-dimethylformamide, then add 1000g of tetraglycidyl ether tetraphenyl Base ethane, after stirring for 30 minutes, add 320g of lauryl methacrylate and 290g of maleic anhydride, react at 95°C for 2 hours, then add 80g of 4-dimethylaminopyridine, and continue to react for 2 hours to obtain an adhesive;

[0031] (3) Add 1000g of hydroxyl silicone resin, 1.5g of dimethylimidazole, and 80g o...

Embodiment 3

[0035] (1) Mix 210g of acrylic acid, 100g of N-methylolacrylamide, 50g of 1,4-cyclohexanedimethanol diacrylate, 240g of N-vinylpyrrolidone, 180g of lauryl methacrylate, and 250g of isomeric tridecyl alcohol polyoxyethylene Add ether and 150g resorcinol monobenzoate to 1000g water, stir for 30 minutes, then add 100mL of 0.1g / mL potassium persulfate aqueous solution dropwise, the dropwise addition is completed within 20 minutes, and react at 75°C for 2.5 hours to obtain a prepolymer ;

[0036] (2) Dissolve 150g of 4,4'-bistrifluoromethoxyazobenzene and 0.15g of dicumyl peroxide into 400g of N,N-dimethylformamide, then add 1000g of tetraglycidyl ether tetraphenyl Base ethane, after stirring for 30 minutes, add 320g of lauryl methacrylate and 290g of maleic anhydride, react at 105°C for 1 hour, then add 80g of 4-dimethylaminopyridine, and continue to react for 1 hour to obtain an adhesive;

[0037] (3) Add 1000g of hydroxyl silicone resin, 1.5g of dimethylimidazole, and 80g of so...

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Abstract

The invention discloses a surface-treated connecting device for a modular building. A preparation method comprises the following steps of preparing a prepolymer by using acrylic acid, N-hydroxymethylacrylamide, 1,4-cyclohexanedimethanol diacrylate, N-vinyl pyrrolidone, lauryl methacrylate, iso-tridecanol polyoxyethylene ether and resorcinol monobenzoate as raw materials; preparing a binder by using 4,4'-ditrifluoromethoxy azobenzene, dicumyl peroxide, tetraglycidyl ether based tetraphenyl ethane, lauryl methacrylate, maleic anhydride and 4-dimethylaminopyridine as raw materials; preparing a primer by using hydroxy silicone resin, dimethyl imidazole, solid amine, vinyltrimethoxysilane, copper phthalocyanine and vinylcyclohexene diepoxide as raw materials; afterwards, treating the connecting device, and completing the surface treatment on the connecting device for the modular building.

Description

[0001] The present invention belongs to the divisional application of the invention patent application whose title is a surface treatment method for a connecting device used in modular buildings, the application number is 201610329368.1, and the application date is 2016.05.17, and it is aimed at the product part. technical field [0002] The invention relates to the technical field of wall equipment, in particular to a surface treatment method for a modular building connection device. Background technique [0003] Modular building is an assembly technology. It uses prefabricated modular components, such as walls, to assemble various houses. The construction is simple and the assembly is flexible. The modular components are prefabricated in the factory, which facilitates the organization of industrialized production, improves work efficiency, reduces material consumption, and is less affected by seasons. Modular buildings have the characteristics of fast construction speed, g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D151/08C09D139/06C09D133/08C09D135/00C09D7/63C08F226/10C08F220/06C08F220/58C08F222/14C08F220/18C08F283/12C08F230/08C08F222/06E04B1/38
CPCC08F220/18C08F222/06C08F226/10C08F283/12C08L2205/035C09D7/63C09D133/08C09D135/00C09D139/06C09D151/08E04B1/38C08F230/08C08F220/06C08F220/58C08F222/102C08F220/1812
Inventor 李海蓉
Owner BOCA HI TECH PRECISION
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