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Chassis heat dissipation system for high-performance computer

A cooling system and computer technology, applied in computing, instrumentation, electrical and digital data processing, etc., can solve the problems of performance degradation of high-performance computers, unstable operation of high-performance computers, poor heat dissipation effect, etc. Small, efficient effect

Inactive Publication Date: 2018-02-23
辜红珍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The chassis of current high-performance computers mostly use fan cooling, poor cooling effect will lead to unstable operation of high-performance computers, and the performance of high-performance computers will decline after a long time of operation

Method used

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  • Chassis heat dissipation system for high-performance computer
  • Chassis heat dissipation system for high-performance computer
  • Chassis heat dissipation system for high-performance computer

Examples

Experimental program
Comparison scheme
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Embodiment

[0019] Such as Figure 1~3 As shown, the chassis heat dissipation system for high-performance computers includes a chassis 2, a plurality of thermoelectric cooling sheets 9 are installed on the inner wall of the chassis 2, and an external power supply 10 is provided outside the chassis 2, and the external power supply 10 It is used to supply power to the thermoelectric cooling sheet 9; a water tank 6 is also provided in the chassis 2, and the inside of the water tank 6 is divided into a hot water chamber 61 and a cold water chamber 62, and a plurality of fans 7 are arranged on the outer wall of the hot water chamber 61; a water circulation system is also included , the water circulation system is composed of cold water pipe 5, hot water pipe 8, water pump 4 and refrigeration device 3, one end of cold water pipe 5 is connected with cold water chamber 62, the other end of cold water pipe 5 is connected with the input end of water pump 4, and the refrigeration device 3. It consis...

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Abstract

The invention discloses a chassis heat dissipation system for high-performance computers, mainly related to computer equipment. The built-in power supply is used to power the thermoelectric cooling sheet. The thermoelectric cooling sheet is used to cool the inside of the chassis, which has fast cooling speed, high efficiency, and small footprint. An independent external power supply is used to power the thermoelectric cooling sheet, which will not affect the internal power supply of the chassis, and the external power supply itself emits The heat will not affect the inside of the case.

Description

technical field [0001] The invention relates to the field of computer equipment, in particular to a chassis cooling system for high-performance computers. Background technique [0002] As a part of computer accessories, the computer case is mainly used to place and fix various computer accessories, and to play the role of support and protection. The chassis of current high-performance computers mostly adopt fan cooling, poor cooling effect will lead to unstable operation of high-performance computers, and the performance of high-performance computers will decline after running for a long time. Contents of the invention [0003] The purpose of the invention is to solve the problem that most of the current high-performance computers use fan-type heat dissipation in the chassis, and the heat dissipation effect is poor, and the performance of the high-performance computer will decline after a long time of operation. In view of the above problems, the present invention provide...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 辜红珍
Owner 辜红珍
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