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Display module and display device

A display module and display panel technology, which is applied in the direction of identification devices, lighting devices, lighting device components, etc., can solve the problems of inability to ensure the positioning accuracy of backlight strips and low product yields, and achieve improved yields and shortened production times. The effect of length

Active Publication Date: 2017-12-15
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] In the display module using COF technology, the lower frame can be narrowed, but in the existing technology, the positioning accuracy during welding of the backlight light bar cannot be guaranteed, and the product yield rate is low.

Method used

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  • Display module and display device

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Embodiment Construction

[0028] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0029] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0030] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0031] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a display module and a display device. The display module comprises a display panel and a backlight module, wherein the backlight module is arranged opposite to the display panel and comprises a backlight light bar, a main flexible circuit board and a COF flexible circuit board, the COF flexible circuit board is connected with the display panel and the main flexible circuit board separately, and the COF flexible circuit board can be bent to make the main flexible circuit board arranged at the side, away from the display panel, of the backlight module; the backlight light bar is connected with the main flexible circuit board through the COF flexible circuit board. According to the display module and the display device, the backlight light bar is connected with the main flexible circuit board through the COF flexible circuit board to achieve driving control of the main flexible circuit board over the backlight light bar, the length of leads drawn forth the backlight light bar can be obviously shortened when the backlight light bar builds circuit connection, the backlight light bar is directly connected with the COF flexible circuit board near to the backlight light bar, when connection is conducted, the problem that the locating precision is hard to guarantee does not exist, and the product yield is increased.

Description

technical field [0001] The present invention relates to the field of display technology, and more specifically, to a display module and a display device. Background technique [0002] With the rapid development of science and technology, electronic smart devices have become an indispensable part of people's lives. While pursuing smooth user experience and diverse functional experience, people are also constantly pursuing better visual experience, such as high contrast display devices, high screen-to-body ratio display devices, etc. Among them, one way to realize a display device with a high screen-to-body ratio is to narrow the lower frame of the display panel. An existing COF (Chip On Film, chip-on-film) technology is a technology that fixes a driver IC to a flexible circuit. On-board (Flexible Printed Circuit, FPC) chip soft film construction technology, using a soft additional circuit board as a package chip carrier to bond the chip to the flexible substrate circuit. In...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/00F21V19/00F21V23/00
Inventor 张豪尔
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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