Chip packaging pedestal for camera module group

A camera module and chip packaging technology, which is applied in image communication, TV, color TV parts, etc., can solve the problems of increasing internal space and insufficient strength, and achieve the effect of enhancing strength

Active Publication Date: 2017-11-24
苏州昀钐精密冲压有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on this, it is necessary to propose a camera module core chip package base, which can make the chip package base in the mobile phone camera module thinner, increase the internal space, and solve the shortcoming of insufficient strength after the chip package base is thinned

Method used

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  • Chip packaging pedestal for camera module group
  • Chip packaging pedestal for camera module group
  • Chip packaging pedestal for camera module group

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Embodiment Construction

[0022] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0023] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to t...

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Abstract

The invention relates to a chip packaging pedestal for a camera module group. The chip packaging pedestal comprises a metal pedestal including a first bearing part at the center and a second bearing part at the edge. The first bearing part is recessed relative to the second bearing part; light transmitting holes are formed around the first bearing part; and the edges of the second bearing part are bent to form support legs. According to the chip packaging pedestal, the first bearing part and the second bearing part are formed at the metal pedestal and are used for supporting a filter piece and a voice coil motor, so that the strength is enhanced and a defect of low strength of the thinned pure plastic element is overcome. Meanwhile, because of the enhanced strength, the thin limit of the pure plastic is broken and thus the larger usage space is provided for packaging of the dual-camera module chip of the mobile phone.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a camera module chip packaging base. Background technique [0002] The chip package base in the mobile phone camera module is a component on the mobile phone camera module, which is used between the electronic components on the PCB board and the voice coil motor. [0003] The chip package base in the mobile phone camera module is a pure plastic part obtained by injection molding. [0004] At present, as mobile phones are getting thinner and thinner, the thickness requirements for the chip package base in the mobile phone camera module are also getting thinner and thinner, and the available space for the mobile phone camera module is getting smaller and smaller. There are more and more components, which requires more and more space for the chip package base in the mobile phone camera module. [0005] At present, the pure plastic part of the chip package base in the mobile pho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
CPCH04N23/50H04N23/55H04N23/54
Inventor 王根
Owner 苏州昀钐精密冲压有限公司
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