Chip packaging pedestal for camera module group

Abstract

The invention relates to a chip packaging pedestal for a camera module group. The chip packaging pedestal comprises a metal pedestal including a first bearing part at the center and a second bearing part at the edge. The first bearing part is recessed relative to the second bearing part; light transmitting holes are formed around the first bearing part; and the edges of the second bearing part are bent to form support legs. According to the chip packaging pedestal, the first bearing part and the second bearing part are formed at the metal pedestal and are used for supporting a filter piece and a voice coil motor, so that the strength is enhanced and a defect of low strength of the thinned pure plastic element is overcome. Meanwhile, because of the enhanced strength, the thin limit of the pure plastic is broken and thus the larger usage space is provided for packaging of the dual-camera module chip of the mobile phone.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a camera module chip packaging base. Background technique [0002] The chip package base in the mobile phone camera module is a component on the mobile phone camera module, which is used between the electronic components on the PCB board and the voice coil motor. [0003] The chip package base in the mobile phone camera module is a pure plastic part obtained by injection molding. [0004] At present, as mobile phones are getting thinner and thinner, the thickness requirements for the chip package base in the mobile phone camera module are also getting thinner and thinner, and the available space for the mobile phone camera module is getting smaller and smaller. There are more and more components, which requires more and more space for the chip package base in the mobile phone camera module. [0005] At present, the pure plastic part of the chip package base in the mobile pho...

AI Technical Summary

Problems solved by technology

[0006] Based on this, it is necessary to propose a camera module core chip package base, which can make the chip package base in the mobile phone camera module thinner, increase the internal space, and solve the shortcoming of insufficient strength after the chip package base is thinned

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