A fpc holding pressure head

A technology of indenter and main body, which is applied in the field of FPC pressure-holding indenter, can solve problems such as low yield rate, component damage, poor firmness, etc., and achieve the effect of solving solidification problems and heat dissipation problems

Active Publication Date: 2019-12-20
东莞市弟兄电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

1. Poor firmness. It is found in the research that due to the lack of air circulation in the pressure head part during the pressure holding, the non-melting parts will melt slightly during the pressure holding, resulting in a low yield rate.
2. Since the pressure head is very hot, the air around it is also very hot when maintaining the pressure, resulting in more or less damage to other nearby components
3. The irritating gas is produced due to the melting of the material. Since the pressure keeping is done in the clean room, this situation will affect the health of the operators.

Method used

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  • A fpc holding pressure head
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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, and the implementation scope of the present invention is not limited thereto.

[0018] like Figure 1 to Figure 4 As shown, the FPC holding pressure head described in this embodiment includes an indenter body; the indenter body includes a wedge-shaped tip 11 and a rectangular block body portion 12; it also includes a heating frame 21, The heating frame 21 has a concave shape, and the main body of the indenter is located in the heating frame 21. The heating frame 21 is provided with a heating rod 22 for heating the main body of the indenter, and one end of the heating rod 22 leans against the main body of the indenter.

[0019] In this embodiment, the top surface of the body part 12 is provided with a mounting block 31, and the top surface of the mounting block 31 is provided with a plurality of threaded fixing holes 32; output.

[002...

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PUM

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Abstract

Disclosed is an FPC pressure-holding ram, comprising a ram main body, wherein the ram main body comprises a wedge-shaped tip portion (11) and a rectangular block-shaped body portion (12); the ram further comprises a heating frame (21), the heating frame (21) being in the shape of the Chinese character "凹", and the ram is located within the heating frame (21); and a heating rod (22) for heating the ram main body is disposed on the heating frame (21), with one end of the heating rod (22) bearing against the ram main body. By means of the arrangement of multiple air suction holes, three problems are solved a single step, that is to say, the problem that harmful gas diffuses into the air and harms the human body is solved, the problem of heat dissipation of nearby elements is solved, and the problem of solidification of a non-melting part is solved.

Description

technical field [0001] The invention relates to an FPC pressure maintaining pressure head. Background technique [0002] The so-called holding pressure refers to the process of binding FPC (flexible circuit board) on the LCD surface in the automatic production process of LCD, which needs to be held by a high-temperature pressure holding head. The traditional pressure-holding indenter used for this kind of pressure-holding is an ordinary solid head, and then the indenter is heated by heating, and then the FPC is pressure-holding. During the pressure holding process, it is often found that when the FPC made of solidified aerobic material is heated and held for pressure, three problems will occur. 1. Poor firmness. It is found in the research that due to the lack of air circulation in the pressure head part during the pressure holding, the non-melting parts will melt slightly during the pressure holding, resulting in a low yield rate. 2. Since the pressure head is very hot, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
CPCG02F1/1303
Inventor 叶伟才
Owner 东莞市弟兄电子有限公司
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