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A kind of polyimide film for preparing artificial graphite film and preparation method thereof

A technology of polyimide film and artificial graphite, which is applied in chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., can solve the problems of low flexibility, graphite film tensile strength, poor mechanical properties of elongation at break, etc. , to achieve the effects of good flexibility, excellent isotropy, and good processing performance

Active Publication Date: 2019-07-19
RAYITEK HI TECH FILM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although graphite films with higher thermal diffusivity can be prepared using this polyimide film, the prepared graphite films have poor mechanical properties such as tensile strength and elongation at break, and low flexibility.

Method used

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  • A kind of polyimide film for preparing artificial graphite film and preparation method thereof
  • A kind of polyimide film for preparing artificial graphite film and preparation method thereof

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Experimental program
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Effect test

preparation example Construction

[0040] One, the preparation method of polyimide film

[0041] 1.1 Preparation of polyamic acid resin

[0042] The polyimide film that can prepare the artificial graphite film of excellent mechanical property described in the present invention, the preparation of its polyamic acid resin adopts the preparation method of known polyamic acid resin: the described diamine raw material and dianhydride The polyamic acid resin solution is obtained by carrying out polycondensation reaction in dimethylacetamide equivalent to 3 to 6 times the total weight of the diamine and dianhydride raw materials according to the molar ratio of the polyamic acid raw materials.

[0043] 1.2 Preparation of slurry containing inorganic fillers

[0044] Using dimethylacetamide as a solvent, adding a calcium-containing compound inorganic filler and making the inorganic filler uniformly dispersed in the solvent to prepare a slurry A containing 5-30% (by weight) of a calcium-containing compound;

[0045] Usi...

Embodiment 1

[0050] React pyromellitic dianhydride, 4,4'-diaminodiphenyl ether, and p-phenylenediamine in dimethylacetamide at a molar ratio of 100:50:50 to obtain a viscosity of 100,000 centipoise. A polyamic acid resin solution with a solid content of 20%.

[0051] Slurry A: Calcium hydrogen phosphate filler, with an average particle size of 3 μm, was added to dimethylacetamide and dispersed by high-speed stirring to prepare a slurry with a solid content of 10%.

[0052] Slurry B: filler ferric oxide, with an average particle size of 3 μm, was added to dimethylacetamide, and dispersed by high-speed stirring to prepare a slurry with a solid content of 10%.

[0053] Add slurry A and slurry B to the prepared polyamic acid resin solution respectively, wherein the filler content in slurry A is controlled to be 0.5% by solid weight of the polyamideimide film material. The filler content in the slurry B is 0.06% by solid weight of the polyamideimide film material.

[0054] Then the resin is e...

Embodiment 2

[0056] Pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 4,4'-diaminodiphenyl ether, p-phenylenediamine in the ratio of 80:20:50:50 The molar ratio is reacted in dimethylacetamide to obtain a polyamic acid resin solution with a viscosity of 100,000 centipoise and a solid content of 20%.

[0057] Slurry A: Calcium hydrogen phosphate filler, with an average particle size of 2 μm, was added to dimethylacetamide and dispersed by high-speed stirring to prepare a slurry with a solid content of 10%.

[0058] Slurry B: filler ferric oxide, with an average particle size of 4 μm, was added to dimethylacetamide, and dispersed by high-speed stirring to prepare a slurry with a solid content of 10%.

[0059] Add slurry A and slurry B to the prepared polyamic acid resin solution respectively, wherein the filler content in slurry A is controlled to be 1.0% by solid weight of the polyamideimide film material. The filler content in the slurry B is 0.05% by solid weight o...

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Abstract

The invention provides a polyimide thin film for preparing an artificial graphite film with excellent mechanical properties and a preparation method of the polyimide thin film. The polyimide thin film is prepared from a raw material diamine monomer which comprises 0 to 75 mol ratio of p-phenylenediamine; the raw material dianhydride monomer, comprises 40 percent to 100 mol ratio of of pyromellitic dianhydride; two types of inorganic fillers, including a calcium-containing compound and transition metal oxide, are uniformly dispersed in the polyimide thin film. The polyimide thin film provided by the invention is applicable to a graphitization process of single-sheet, multilayered stacking and continuous coiled materials and can be used for carrying out graphitization at temperature of 2300 DEG C; the crystallization degree is less than 10 percent. The graphite film prepared from the polyimide thin film has an excellent heat conducting property and has excellent mechanical properties in longitudinal and lateral directions of the thin film; the modulus is less than or equal to 2000MPa, the elongation at break is more than or equal to 3 percent, the tensile strength is more than or equal to 40MPa and the difference of the longitudinal and lateral directions is less than 15 percent.

Description

technical field [0001] The invention belongs to the field of high molecular polymer materials, and in particular relates to a polyimide film and an artificial graphite film prepared from the polyimide film. [0002] The invention also relates to a preparation method of the polyimide film. Background technique [0003] Driven by the development trend of thinner intelligent electronic equipment and higher density of internal circuit design, the use of reliable heat dissipation design inside electronic equipment has become a basic requirement to ensure stable operation of equipment. At present, the artificial graphite film prepared by polyimide film has the characteristics of thin thickness, high thermal conductivity, flexibility and easy processing, which can meet the heat dissipation design requirements of the small space inside the electronic device, and has become an important part of various intelligent mobile electronic devices. An important heat dissipation material for...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K3/22C08J9/08C08J9/04C08J5/18C08G73/10C01B32/205
CPCC08G73/1067C08G73/1071C08J5/18C08J9/04C08J9/08C08J2379/08C08K3/22C08K2003/2241C08K2003/2272C08K2003/2275C08K2201/003C08L2203/14C08L2203/16C08L79/08
Inventor 何志斌袁舜齐汤昌丹徐飞廉海燕
Owner RAYITEK HI TECH FILM CO LTD
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