Middle frame component and production method thereof

Abstract

Embodiments of the invention provide a middle frame component and a production method thereof. The middle frame component is a support component which is in an electronic product and is used for supporting components of the electronic product. The middle frame component comprises a middle frame base material body, a first metal layer and an insulation passivation layer, wherein the first metal layer is attached to a first area of the middle frame base material body; a heat conductivity coefficient of the first metal layer is greater than a heat conductivity coefficient of the middle frame base material body; the first area includes all or parts of external surfaces of the middle frame base material body; the first metal layer is used for conducting heat generated by at least one component which is contacted with or adjacent to the first metal layer to the whole first metal layer and the middle frame base material body; and the insulation passivation layer is attached to a surface of the first metal layer. In the embodiments of the invention, heat dissipation performance of the middle frame component can be increased.

Description

technical field [0001] The invention relates to the communication field, in particular to a middle frame and a production method thereof. Background technique [0002] With the development of electronic products, the demand for heat dissipation of electronic products is getting higher and higher. The materials of the middle frame parts of existing electronic products have gradually been unable to meet the current heat dissipation requirements. For example, the current middle frame materials of mobile phones have gradually been unable to meet The current heat dissipation requirements, especially the mobile phone chip area with relatively large power consumption, generate a large amount of heat, resulting in excessive temperature in some parts of the middle frame. The existing materials commonly used in the middle frame of mobile phones are die-casting magnesium alloy, stainless steel, and die-casting aluminum. Alloy and die-cast zinc alloy have a thermal conductivity between ...

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic products, the demand for heat dissipation of electronic products is getting higher and higher. The materials of the middle frame parts of existing electronic products have gradually been unable to meet the current heat dissipation requirements. For example, the current middle frame materials of mobile phones have gradually been unable to meet The current heat dissipation requirements, especially the mobile phone chip area with relatively large power consumption, generate a large amount of heat, resulting in excessive temperature in some parts of the middle frame. The existing materials commonly used in the middle frame of mobile phones are die-casting magnesium alloy, stainless steel, and die-casting aluminum. Alloy and die-cast zinc alloy have a thermal conductivity between 10 and 160W / m.k, which cannot conduct heat quickly, so that the heat in the local high-temperature area of ​​the middle frame cannot be transferred to the low-temperature area in time, and thus cannot effectively reduce the local temperature. The temperature at a high temperature location cannot meet the current application requirements for mobile phone heat dissipation

Images