Processing method for removing burrs from flexible printed circuit board region of rigid-flexible printed circuit board
A technology of rigid-flex board and processing method, applied in flexible printed circuit boards, electrical components, printed circuit manufacturing, etc., can solve problems such as waste of polyester film materials
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[0027] In order to fully understand the technical content of the present invention, the technical solutions of the present invention will be further introduced and illustrated below in conjunction with specific examples, but not limited thereto.
[0028] Such as Figures 2 to 3 In the specific embodiment shown, this embodiment provides a processing method for removing burrs in the soft board area of the rigid-flex board, which can be used in the production process of the rigid-flex board to solve the problem of burrs on both sides of the soft board in the flexible area. The problem is that the flexible board has high precision in dimension and low cost, and does not waste materials.
[0029] Such as image 3 As shown, a processing method for removing burrs in the soft board area of a rigid-flex board, the method includes:
[0030] S1. Expand a certain size to the waste area along the two sides of the soft board at the non-link position in the flexible area, and use a for...
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