Angle limiting hinge applied to semiconductor equipment

Abstract

The invention provides a limiting hinge which can enable chamber opening and closing operations to be more convenient and flexible and can fix angles in a semiconductor plasma processing device. The limiting hinge is connected between an upper cover plate in a reaction chamber module of semiconductor plasma equipment and the outer surface of a reaction chamber body. The angle limiting hinge is mainly composed of an upper hinge body, a lower hinge body, a fixing pin, a rotating shaft and a limiting block. The upper hinge body is connected with the upper cover plate of a reaction chamber, the lower hinge body is connected with the reaction chamber body, the two hinges are fixed through the rotating shaft, and the upper hinge body can rotate along the rotating shaft; and the detachable fixing pin can be fixed in a pin hole and matched with the limiting block, and therefore a fixed angle is kept between the upper hinge body and the lower hinge body. The angle limiting hinge is simple in structure, and not only is structural compactness in a limited space at a specific position achieved, but also the influence that pressure of a conveying module of the plasma equipment is too large during chamber opening and closing can be avoided. The angle limiting hinge can be widely applied to the field of semiconductor technologies.

Description

Technical field [0001] The invention relates to an angle limit hinge, in particular to a fixed angle hinge in a semiconductor plasma device, and belongs to the technical field of semiconductor manufacturing. Background technique [0002] Nowadays, the design of the fixed-angle hinge in the reaction module of the plasma equipment in the semiconductor industry is very important. It not only involves the portability and flexibility of the switch cavity operation, but also the space occupied by the switch cavity and the upper cover of the cavity. Excessive pressure caused by the board. In the previous design, the angle of the plasma equipment is large when opening and closing the cavity, and the weight of the upper cover plate of the cavity is too large, and the upper cover plate is very easy to cause pressure on the transmission module when the cavity is opened. At present, with the continuous development of semiconductor technology, we are required to reduce the force of the switc...

AI Technical Summary

Problems solved by technology

In the previous design, the angle of opening and closing of the plasma equipment is very random, and the weight of the upper cover plate of the cavity is too heavy. When the cavity is opened, the upper cover plate is very easy to cause pressure on the transmission module.

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