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Packaging technique of LED display screen module

A technology of LED display and packaging technology, which is applied in the direction of identification devices, instruments, electrical components, etc., which can solve the problems of low resolution and insufficient display effect, so as to improve the resolution, display better and more delicate, and increase the unit area pixel effect

Active Publication Date: 2017-04-26
SHENZHEN JIEJIANDA INNOVATION TECH CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] At present, the LED display screens on the market generally adopt the in-line packaging process or the patch packaging process. Due to the limitation of the packaging form of these two packaging processes, in the prior art, because the display screen must use a bracket, only one red and green can be used. The combination of blue is used as a pixel, and the structure of the bracket will cause the distance between each pixel to be greater than 2Mm, so the resolution will be relatively low, and the display effect will not be delicate enough

Method used

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  • Packaging technique of LED display screen module

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Embodiment Construction

[0019] In conjunction with the accompanying drawings, the specific implementation manners of the present invention will be further described in detail, so as to make the technical solution of the present invention easier to understand and grasp.

[0020] A packaging process for an LED display module, comprising the following steps:

[0021] 1) The red, blue and green display chips are sealed on the surface of the colloid according to the law;

[0022] 2) Plating the first layer of conductive film on the back of the red, blue and green display chips, and carving off the excess film to form the required conductive lines, so that the chips are connected in series;

[0023] 3) Cover a protective layer on the first layer of conductive film, and engrave off the protective layer of the first chip pad (BOND PAD) to expose the pad;

[0024] 4) Plating a second layer of conductive film on the protective layer, and carving off the excess film to form the required conductive line, and to...

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Abstract

The invention discloses a packaging technique of an LED display screen module. The packaging technique includes the following steps: packaging red, blue and green display chips on the surface of an adhesive in order; coating the back sides of the red, blue and green display chips with first conductive membranes, and removing the superfluous membranes through engraving to form needed conductive lines so that the chips are in series connection; covering the first conductive membranes with protective layers, and removing bond pad protective layers of all the chips through engraving to make bond pads exposed; coating the protective layers with second conductive membranes, removing the superfluous membranes through engraving to form needed conductive lines, and enabling conduction between the chips and a controller; and covering the second conductive membranes with adhesives to finally finish packaging of an LED display screen module. The packaging technique of the LED display screen module helps to increase pixels per unit area, improve display effects and save the cost.

Description

technical field [0001] The invention relates to the packaging of LED display screens, in particular to a packaging process for LED display screen modules. Background technique [0002] At present, the LED display screens on the market generally adopt the in-line packaging process or the patch packaging process. Due to the limitation of the packaging form of these two packaging processes, in the prior art, because the display screen must use a bracket, only one red and green can be used. The combination of blue is used as a pixel, and the structure of the bracket will cause the distance between each pixel to be greater than 2Mm, so the resolution will be relatively low, and the display effect will not be delicate enough. Contents of the invention [0003] In view of this, the purpose of the present invention is to provide a packaging process for LED display modules without substrate packaging, higher splicing efficiency and more delicate display effect. [0004] In order t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/48H01L33/52H01L25/075G09F9/33
CPCG09F9/33H01L25/0753H01L33/483H01L33/52H01L33/62H01L2933/005H01L2933/0066
Inventor 涂波
Owner SHENZHEN JIEJIANDA INNOVATION TECH CO LTD
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