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Temperature-based CPU dynamic frequency modulation apparatus and method

A technology of dynamic frequency modulation and CPU temperature, applied in the field of CPU frequency modulation, can solve the problems of setting explosion, physical damage of mobile phone, no automatic adjustment method, etc., and achieve the effect of avoiding physical damage, avoiding physical damage and explosion

Inactive Publication Date: 2017-04-26
WUHAN DOUYU NETWORK TECH CO LTD
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  • Claims
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AI Technical Summary

Problems solved by technology

When the mobile phone is exposed to high temperature for a long time, it may cause physical damage to the mobile phone, and serious settings may cause danger such as explosion
However, the existing Android mobile phone does not have an automatic adjustment method for the situation of excessive temperature, and the user can only shut down the mobile phone to play a protective role.

Method used

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  • Temperature-based CPU dynamic frequency modulation apparatus and method
  • Temperature-based CPU dynamic frequency modulation apparatus and method

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Embodiment Construction

[0047] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0048] Such as figure 1 As shown, the temperature-based CPU dynamic frequency adjustment device in the embodiment of the present invention includes:

[0049] The temperature collection module is used to obtain the CPU temperature of the Android mobile phone in real time; the temperature collection module includes a temperature sensor unit, a temperature receiving unit and a sensor management unit; the temperature sensor unit is used to collect the CPU temperature; the temperature reception unit is used to obtain the temperature collected by the temperature sensor unit CPU temperature, start the temperature control module; the sensor management unit is used to obtain all sensor units of the system, and register the temperature receiving unit.

[0050] The temperature control module has 4 built-in temperature ranges, and is used to dynamically ...

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Abstract

The invention discloses a temperature-based CPU dynamic frequency modulation apparatus and method, and relates to the CPU frequency modulation field of an Android mobile phone. The apparatus comprises a temperature collection module used for obtaining a CPU temperature of the Android mobile phone in real time, and a temperature control module which has four built-in temperature ranges and is used for dynamically switching the CPU to a corresponding working mode according to the temperature range of the CPU. The CPU working mode of the Android mobile phone is automatically adjusted through the temperatures; and when the temperature is too high, the CPU working frequency is lowered to protect the mobile phone, so that physical damage of the mobile phone caused by the too high temperature can be avoided.

Description

technical field [0001] The invention relates to the field of CPU frequency modulation of Android mobile phones, in particular to a temperature-based CPU dynamic frequency modulation device and method. Background technique [0002] At present, mobile phones have become an indispensable communication tool in people's lives. Usually, during the use of an Android mobile phone, if the CPU (Central Processing Unit, central processing unit) runs at high speed for a long time, the power consumption is relatively high, and the CPU temperature of the entire mobile phone will be relatively high. When the mobile phone is exposed to high temperature for a long time, it may cause physical damage to the mobile phone, and serious settings may cause danger such as explosion. And the existing Android mobile phone does not have an automatic adjustment method for the situation that the temperature is too high, and the user can only shut down the mobile phone to play a protective role. Conten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/32G06F1/20
CPCG06F1/3243G06F1/20
Inventor 张磊
Owner WUHAN DOUYU NETWORK TECH CO LTD
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