Middle frame structure with heat insulation function and electronic device

Abstract

The invention provides a middle frame structure with a heat insulation function and an electronic device. The middle frame, which is applied to an electronic device, comprises a body and a frame unit. The frame unit comprises an inner side, an outer side, and a heat insulation layer. The heat insulation layer is located between the inner layer and the outer layer. The inner layer is adjacent to the body. The outer layer is at the outermost side of the frame unit. Heat of the body is stopped by the heat insulation layer from being transferred to the outer layer of the frame unit.

Description

【Technical field】 [0001] The invention relates to the field of portable electronic equipment, in particular to a heat-insulating middle frame structure and electronic equipment. 【Background technique】 [0002] At present, the size of smart personal electronic devices such as mobile phones, tablet computers or portable readers is getting bigger and thinner, which makes the heat dissipation performance of electronic devices worse and worse. However, most of the heat generated in electronic devices comes from various Generated by the operation of functional units, such as the operation of central processing units (especially the configuration of multi-core computing units for the improvement of execution speed, which will worsen the heat dissipation problem of terminal equipment), batteries, power converters, display screens and other units Both will lead to increased or exacerbated heat generation of electronic equipment. At present, the heat source of most electronic equipme...

AI Technical Summary

Problems solved by technology

[0002] At present, the size of smart personal electronic devices such as mobile phones, tablet computers or portable readers is getting bigger and thinner, which makes the heat dissipation performance of electronic devices worse and worse. However, most of the heat generated in electronic devices comes from various Generated by the operation of functional units, such as the operation of central processing units (especially the configuration of multi-core computing units for the improvement of execution speed, which will worsen the heat dissipation problem of terminal equipment), batteries, power converters, display screens and other units Both will cause the heat generation of electronic equipment to increase or aggravate

At present, the heat source of most electronic equipment is fixed on the middle frame structure of the electronic equipment, so the middle frame first absorbs the heat generated by the execution of each functional unit, so after the electronic equipment is turned on, the temperature of the middle frame is very easy to rise, resulting in The temperature of the body and the outer edge of the frame is extremely high. When the user holds the electronic device, due to the large size of the current electronic device (for example, the mainstream of the touch mobile phone is more than 5 inches), the user can hardly fully grasp it. Using the grip between fingers, the contact points or positions for gripping electronic devices are mostly located on the outer edge or longer sides of the middle frame, causing high temperature conduction to the outer edge of the middle frame, which will affect or cause troubles for users in use and inconvenient

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