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Method for controlling mushroom cap adhesion in edible mushroom fruiting process

A technology of edible fungi and mushroom caps, applied in botany equipment and methods, applications, horticulture, etc., can solve the problems of edible fungus production hazards, factory grain failure, affecting product quality, etc., to reduce the chance of touching, increase height effect

Inactive Publication Date: 2017-02-01
SHANGHAI ZHINONG BIOLOGICAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] With the annualization, factoryization, and high-density planting, some diseases and insect pests or deformed mushrooms that are not common in nature will follow, and these diseases and insect pests or deformed mushrooms will bring great harm to the production of edible fungi. Product quality, if it is serious, it will lead to the failure of the whole factory

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  • Method for controlling mushroom cap adhesion in edible mushroom fruiting process
  • Method for controlling mushroom cap adhesion in edible mushroom fruiting process

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Embodiment Construction

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1-2 , the present invention provides a technical solution: a method for controlling the adhesion of mushroom caps in the process of edible fungus fruiting, including the production factors of edible fungus fruiting process: scratching depth, light intensity and CO 2 Concentration, scratching depth, light intensity and CO 2 The concentration includes the following raw materials in parts by weight:

[0024] Level 1: Scratch depth 1.2cm, light...

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Abstract

The invention discloses a method for controlling mushroom cap adhesion in an edible mushroom fruiting process. Production factors of the edible mushroom fruiting process comprise: old strain block removing depth, illumination intensity and CO2 concentration; experiment data shows that the old strain block removing depth is increased to keep local humidity and CO2 concentration around an old strain block removing material surface; the heights of mushroom stems are increased through relatively high CO2 concentration and relatively less illumination; the mushroom stems are expanded outwards from a bottle mouth, so that the opportunity that one mushroom cap is in contact with the other mushroom cap is reduced; and an adhesion phenomenon does not occur when no contact between the mushroom caps exists.

Description

technical field [0001] The invention relates to the field of edible fungus planting, in particular to a method for controlling mutual adhesion of mushroom caps during industrialized planting of edible fungi during the fruiting period. Background technique [0002] The industrial cultivation of edible fungi is actually closed, facility-based, mechanized, standardized, and annual cultivation. It is in a closed factory designed according to the growth needs of mushrooms, using temperature control, humidity control, Wind control and light control equipment create an artificial environment; use mechanical equipment automation (semi-automation) operation, high-efficiency production; through modern enterprise management mode, organize employees to produce orderly; in the unit space, three-dimensional, large-scale, annual cultivation High-quality edible fungi that meet the product safety and green (organic) standards are sold to domestic and foreign markets through packaging, proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A01G1/04
Inventor 杨仁智吴利华虞方伯
Owner SHANGHAI ZHINONG BIOLOGICAL SCI & TECH
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