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Distribution type heat collection board molding method

A forming method and a heat collecting plate technology, which are applied in the field of spacecraft thermal control, can solve the problems that the new heat collecting plate cannot be guaranteed to meet the use requirements, and the heat collecting plate is difficult to manufacture and form, so as to ensure good appearance, reduce weight, reduce volume effect

Active Publication Date: 2017-01-11
BEIJING INST OF SPACECRAFT SYST ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In short, due to the improvement of the technical requirements of the new heat collector plate for the return satellite recovery module, such as external dimensions, mechanical interface and thermal interface, it has caused considerable difficulties in the manufacture and molding of the heat collector plate. The traditional method can no longer guarantee that the new heat collector plate can To meet the requirements of use, it is necessary to explore a new molding method to ensure the manufacturing and molding of new heat collectors

Method used

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  • Distribution type heat collection board molding method
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  • Distribution type heat collection board molding method

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Embodiment Construction

[0036] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0037] The invention provides a method for forming a distributed heat collecting plate, the processing steps are as follows:

[0038] Step 1: Design and process integrated stainless steel fixture plates, such as image 3 As shown, there is a weight-reducing hole on one side of the fixture plate, pre-baking the fixture plate before use, the pre-baking temperature is 650±3°C, and the holding time is 1.5±0.1h, so that the gas inside the fixture plate can be fully released;

[0039] Step 2: In order to ensure the flatness of the welding wheel embedded block 1 and the fin deflector 4, the flatness of the clamping surface of the fixture plate must be higher than that of the heat collector wheel embedded block 1 and the fin deflector The design of 4 requires flatness, therefore, the clamping surface of the fixture plate is milled before use, so that the flatness...

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Abstract

The invention discloses a distribution type heat collection board molding method. The method comprises the steps that a stainless steel clamp plate which is integrally molded is firstly designed, and the whole flatness of the clamp plate meets the use requirement; according to the appearance requirement for machining a distribution type heat collection board, fins and wheel type embedded blocks are machined, and the heat collection board is assembled; through the integrally-molded stainless steel clamp plate, the novel distribution type heat collection plate is subjected to whole brazing, and in the brazing process, the welding temperature condition is strictly ensured; a process hole is formed in the heat collection plate obtained after brazing. According to the method, the problem that the technical requirement caused by increasing of the appearance size, increasing of number of mechanical connectors, irregular distribution of hot connectors and the like of a novel returning satellite single-phase fluid loop heat collection board needs to be improved, and consequently, the heat collection problem to manufacturing and molding of the heat collection board is caused is solved.

Description

technical field [0001] The invention relates to the technical field of spacecraft thermal control, in particular to a forming method of a distributed heat collecting plate. Background technique [0002] Satellite heat collector plate is a special plate-fin heat exchanger with only one layer of heat exchange channels, consisting of upper and lower panels, guide fins, heat exchange fins, seals, and embedded blocks. The electronic equipment is installed on the surface of the upper and lower panels of the cold plate. The working medium enters the interior of the cold plate through the joints, is distributed by the guide fins, and evenly enters the heat exchange fins. After taking away the heat emitted by the electronic equipment on the outer surface of the panel, the temperature Elevated to flow out of the fitting at the other end. The working medium whose temperature has risen is re-cooled and then flows into the cold plate to form a cycle. [0003] In order to solve the prob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/26
CPCB23P15/26
Inventor 杨沪宁刘庆志任红艳关金鹏申言森张瑞
Owner BEIJING INST OF SPACECRAFT SYST ENG
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