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High viscosity modified pi film

A high-viscosity and modified technology, applied in the field of PI film, can solve the problems of lowering the mechanical properties of materials and lowering the bottom, and achieve the effect of improving the surface viscosity, increasing the grafting rate and avoiding recession.

Active Publication Date: 2020-01-14
SUZHOU KECHUANG ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the traditional surface modification methods use wet chemical modification methods. For wet chemical modification, the polymer chains are partially degraded and sheared, which leads to the reduction of the mechanical properties of the material and further degradation.

Method used

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  • High viscosity modified pi film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Preparation of surface modified PI film:

[0028] (1) Surface physical modification

[0029] A film with a PI film thickness of 10-20 μm is selected, and a convex-convex structure of 0.5-2 μm is formed on both sides of the PI film by compression molding of a molding die.

[0030] (2) Surface chemical modification

[0031] S1: Cleaning, take the physically modified PI film in a mixed weak alkaline solution of sodium carbonate, sodium phosphate and sodium dodecylbenzenesulfonate to degrease, decontaminate and microetch for 5-15 minutes, then wash it with tap water, dry for later use;

[0032] S2: Plasma treatment, place the cleaned and dried PI film in a plasma vacuum chamber, and use glow discharge to perform low-temperature plasma treatment on the PI film under an argon flow of 0.6 Torr, with a power of 35W and a treatment time of 1-2 60s;

[0033] S3: Activation, take out the treated PI film and put it in the air for 5 minutes to 1 hour to form active centers;

[...

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Abstract

The invention discloses a high-viscidity modified PI film. The surface of the high-viscidity modified PI film is sequentially subjected to physical modification and chemical modification; for the physical modification, at least one layer of the PI film is provided with a convex-concave structure; the depth of the concave structure in the convex-concave structure is smaller than the thickness of the PI film; the convex-concave structure of the PI film is made by using a photoetching mold, or is compressed and formed by a molding pressing mold; for the chemical modification, plasma treatment and surface grafting modification are combined. The prepared high-viscidity modified PI film has the beneficial effects that the viscidity is high; the hydrophilia is high; the adhesion with bonding agents can be favorably improved.

Description

technical field [0001] The present invention relates to a PI film. More specifically, the present invention relates to an electrically modified PI film with a high viscosity. Background technique [0002] PI film has excellent mechanical properties, heat resistance, electrical properties, flame retardancy and radiation resistance, etc. It is widely used in various fields such as aerospace industry, electronic and electrical industry and information industry. As a flexible printed circuit base material, high temperature resistant wires, cables and insulation of electrical appliances, it plays a great role in reducing product quality, reducing volume and improving performance. [0003] Because PI materials are resistant to high temperature and deflection, they can adapt to the demands of modern products for lightness, thinness and high safety. The largest application market of PI film is flexible circuit boards, which are mainly used for base film and cover film of flexible ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/16C08L79/08B29C59/14B29C59/02
CPCB29C59/02B29C59/14C08J7/16C08J2379/08
Inventor 李彦
Owner SUZHOU KECHUANG ELECTRONICS MATERIAL CO LTD
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