Ultrasonic precise sealing connecting device and method

Abstract

The invention discloses an ultrasonic precise sealing connecting device and method. The device comprises an ultrasonic generator, an ultrasonic transducer, an ultrasonic tool bit, a pressure applying mechanism, a sealing connecting worktable, a data processing unit and a control unit. The control unit controls a drive motor to control the ultrasonic tool bit to move along a movement guide rail. A piezoelectric acceleration sensor is used for detecting vibration information of the bottom of a machined device. A piezoelectric dynamic pressure sensor is used for detecting the dynamic pressure borne by the machined device. A data acquisition card is used for acquiring vibration information detected by the piezoelectric acceleration sensor and dynamic pressure detected by the piezoelectric dynamic pressure sensor. The control unit controls the drive motor and the ultrasonic generator to work according to data information transmitted by the data acquisition card. The control unit controls the ultrasonic generator to transmit ultrasonic waves different in amplitude. According to the ultrasonic precise sealing connecting device and method, self-adaptation compensation can be made for errors existing on the surface of a micro device, consistency of the sealing connecting quality is improved, and the sealing connecting precision is improved.

Description

technical field [0001] The invention relates to the technical field of micro-nano system assembly, in particular to an ultrasonic precision sealing device and method. Background technique [0002] Thermoplastic polymer materials are more and more widely used in the field of micro-nano manufacturing. The integration of polymer micro-nano functional devices and the assembly of components have become key technologies in micro-nano manufacturing technology. Ultrasonic sealing has the advantages of high strength, high efficiency, local heat generation, and no need to introduce additives. Since it was applied to the packaging of microfluidic chips, micropumps, and microvalves in 2006, it has demonstrated good technical advantages and potential. As the application field of ultrasonic welding technology shifts from large-sized parts to micro-nano structures with smaller sizes and higher precision requirements, its research focus shifts from strength to precision. Shape accuracy, wh...

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Problems solved by technology

[0005] However, among the above-mentioned technologies, the ultrasonic sealing technology is relatively mature in the connection of macro devices, but there are still some problems in the connection of micro devices. The larger amplitude will affect the shape accuracy of micro devices, and will cause microstructures to a certain extent. damage; in addition, it is difficult to achieve precise control of pressure and tool head position in the prior art, and there are certain difficulties in precise control of energy

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