A modular airtight cold conduction chassis

Abstract

The invention relates to a modular airtight cold guide case, which comprises an airtight case body, cold guide plug-ins and a plurality of cold guide modules, wherein the plurality of cold guide modules are arranged in the airtight case body side by side; the cold guide plug-ins are clamped into the cold guide modules respectively; an adapter plate is arranged at one side of the airtight case body; a fan is arranged at the other side of the airtight case body; the airtight case body comprises a front end plate, an upper end plate and a lower end plate; a plurality of cooling teeth are arranged on the upper end surface and the lower end surface of each cold guide module; and the cooling teeth between the adjacent cold guide modules are arranged in a staggered manner. The modular airtight cold guide case can be applied to all occasions employing the airtight cold guide case. For different airborne models, the number of the plug-ins used in the case only needs to be confirmed and a corresponding number of cold guide modules are selected to be assembled, so that the design task is greatly simplified; the human cost and the production cost are reduced; the cooling teeth are arranged in the staggered manner; and the cooling effect is improved.

Description

technical field [0001] The invention relates to a cooling conduction cabinet, in particular to a modular airtight cooling conduction cabinet. Background technique [0002] Due to the complex use environment provided by the aircraft carrier, the airborne model mostly uses a closed cooling conduction electronic chassis as a module to realize the radar function. Due to the particularity of the use environment, the structure and size of the electronic chassis used in different airborne models are quite different, so designers need to design individually for each model, and the workload is very large; The overall weight requirement is very high, which makes it difficult to realize the commonality of electronic chassis among different models, and increases the cost of research and development and production. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a modular airtight cooling conduction chassis, which solves the...

AI Technical Summary

Problems solved by technology

Due to the particularity of the use environment, the structure and size of the electronic chassis used in different airborne models are quite different, so designers need to design individually for each model, and the workload is very large; The overall weight requirement is very high, which makes it difficult to realize the commonality of electronic chassis among different models, which increases the cost of research and development and production

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