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Method and heat dissipation device for adjusting heat dissipation

A technology of heat dissipation device and opening and closing device, which can be used in instruments, computing, electrical and digital data processing, etc., and can solve problems such as noise increase

Active Publication Date: 2019-06-25
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, taking a notebook computer as an example, when the load of heat-generating devices such as the central processing unit CPU and image processing unit GPU increases sharply, the heat generated during the heating period suddenly increases. In order to dissipate heat in time, the speed of the cooling fan is often increased immediately , however, will make the noise increase at the same time

Method used

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  • Method and heat dissipation device for adjusting heat dissipation
  • Method and heat dissipation device for adjusting heat dissipation
  • Method and heat dissipation device for adjusting heat dissipation

Examples

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Effect test

Embodiment 1

[0018] This embodiment provides a heat dissipation device, which can be installed in electronic devices that require heat dissipation, such as ordinary notebook computers, ultrabooks, smart phones, tablet computers, and sports hard disks, which are not specifically limited in the present invention.

[0019] see figure 1 As shown, the heat dissipation device includes: a housing 1, a first chamber is formed in the housing 1, and a first air outlet communicating with the first chamber is provided on the housing 1; a first opening and closing device 2 is provided with the housing 1 corresponding to the first air outlet; wherein, when the first opening and closing device 2 moves from the first position to the second position relative to the first air outlet, the air output of the first air outlet increases by the first value. up to the second value.

[0020] Here, a heat dissipation channel is formed inside the electronic equipment, including the first heat generating device and t...

Embodiment 2

[0043] There is often more than one heat generating device in an electronic device, so other heat generating devices also have heat dissipation requirements.

[0044] Then, on the basis of the first embodiment above, a second chamber is formed in the casing, and the casing has a second air outlet communicating with the second chamber;

[0045] Correspondingly, the heat dissipation device further includes: a second opening and closing device, which is set at a position corresponding to the second air outlet in the housing, wherein, when the second opening and closing device moves from the third position to the fourth position relative to the second air outlet position, the air volume of the second air outlet increases from the third value to the fourth value.

[0046] That is to say, there can be multiple pairs of heat dissipation channels inside the electronic device at the same time, such as the heat dissipation channels of the second heat-generating device. Each heat dissipa...

Embodiment 3

[0048] On the basis of the above-mentioned first embodiment, electronic equipment often has more than one heating device, and may also include a second heating device. At this time, the second heating device has heat dissipation requirements. Due to the size limitation of electronic equipment, when electronic equipment When there are multiple heat dissipation channels inside, these heat dissipation channels can be concentrated in one area of ​​the shell, see Figure 6 As shown, the first air outlet 12 and the second air outlet 13 are arranged adjacent to each other, that is, the first air outlet 12 and the second air outlet 14 are respectively arranged on the first side 101 and the second side 102 adjacent to the housing 1 In this way, the heat dissipation device can dissipate heat to the first heat generating device 61 and the second heat generating device 62 at the same time. Then, only one opening and closing device, such as the first opening and closing device, may be prov...

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Abstract

The embodiment of the invention discloses a heat dissipation device. The heat dissipation device comprises a shell and a first opening and closing device. A first cavity is formed in the shell, and the shell is provided with a first air outlet communicated with the first cavity. The first opening and closing device is arranged at the position, corresponding to the first air outlet, in the shell, and when the first opening and closing device moves to a second position from a first position relative to the first air outlet, the air output volume of the first air outlet is increased to a second value from a first value. Meanwhile, the embodiment of the invention discloses a heat dissipation adjusting method.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic equipment, in particular to a method for adjusting heat dissipation and a heat dissipation device. Background technique [0002] With the continuous development of science and technology, electronic technology has also developed rapidly, and there are more and more types of electronic products, and people have also enjoyed various conveniences brought by the development of science and technology. Now people can enjoy the comfortable life brought by the development of science and technology through various types of electronic devices. [0003] At present, taking a notebook computer as an example, when the load of heat-generating devices such as the central processing unit CPU and image processing unit GPU increases sharply, the heat generated during the heating period suddenly increases. In order to dissipate heat in time, the speed of the cooling fan is often increased immediately , ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/202
Inventor 贾自周
Owner LENOVO (BEIJING) LTD
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