Readout Circuit and Readout Method of Resistive Composite Sensor Array

Abstract

The invention discloses a readout circuit of a resistive composite sensor array, and belongs to the technical field of a sensor. An array structure and a corresponding readout circuit are designed based on a dual-voltage feedback method for solving the problem of data reading speed of a two-dimensional array composed of resistive composite sensors each internally comprising even-numbered two-terminal resistive sensitive units. Resistance of two resistive sensitive units sensitive to different physical amounts in the same resistive composite sensor can be read through single detection, such that the data detection speed of the sensor array can be substantially improved, and at the same time, the complexity of a sensing system is effectively reduced. The invention further discloses a readout method of the readout circuit. Compared to the prior art, the detection speed is faster, some to-be-tested resistive sensitive units needing high-frequency detection can be detected multiple times in scanning of one time, and besides, the circuit complexity and the realization cost are lower.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a readout circuit of a resistive composite sensor array and a readout method thereof. Background technique [0002] The array sensing device is to combine multiple sensing elements with the same performance according to the structure of a two-dimensional array. It can change or generate corresponding shapes and characteristics by detecting changes in parameters focused on the array. This feature is widely used in biosensing, temperature tactile and thermal imaging based on infrared sensors, etc. [0003] Resistive sensing arrays are widely used in infrared imaging simulation systems, force tactile sensing and temperature tactile sensing. Taking temperature touch as an example, since the temperature sensing device involves the transfer of heat and the perception of temperature, in order to obtain the thermal properties of the object, the device puts forward higher requirements fo...

AI Technical Summary

Problems solved by technology

Using a 16×16 array network bolometer array for verification, only 32 pins are used, it has been confirmed that the model can effectively distinguish device damage or small changes in device value, it has a certain accuracy, but there is still a problem in detection speed technical flaw

In 2009, Y.J.Yang et al. proposed a 32×32 array of temperature and tactile sensing arrays for the artificial skin of the robotic arm. A multiplexer was added to the array network, and the speed of row selection and column selection was greatly accelerated. The maximum detection The rate can reach 3000 sensing units per second, but the detection of this array can only detect a single unit to be tested each time, and the detection efficiency becomes the biggest technical bottleneck

For a sensor array composed of such resistive composite sensors, if the traditional voltage feedback method is used for scanning measurement, the same single measurement can only obtain the resistance of a single resistive sensitive unit, and the detection speed is low

In addition, due to the larger number of resistive sensitive units in the sensor array, it also brings about the problem of too many connections and high complexity required for the formation of the array.

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