A self-heating high-power integral LED package

A technology of LED packaging and high power, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low luminous efficiency of LED chips, inhibition of LED current recession, and increased energy loss, so as to inhibit the recession phenomenon and improve the luminous effect. , the effect of increasing the area

Active Publication Date: 2017-09-29
GUANGDONG UNIV OF SCI & TECH
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, under the premise of such a high-power current density, the applicant found after many experiments that it would cause two serious problems. First, the LED has a phenomenon of current suppression fading, that is, the higher the current density is, the lower the current density is. The lower the luminous efficiency of high LED chips, the higher the current density, the greater the energy loss will be.
The second is the heat dissipation problem, that is, the heat is very large, which will have a certain impact on LEDs. Therefore, the market should urgently need to solve the above two problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A self-heating high-power integral LED package
  • A self-heating high-power integral LED package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, and the implementation scope of the present invention is not limited thereto.

[0019] Such as Figures 1 to 2 As shown, a self-heating high-power integral LED package described in this embodiment includes a metal heat dissipation base a1, and a plurality of LED epitaxial wafers a2 are arranged on the metal heat dissipation base a1;

[0020] The LED outer edge sheet includes a metal substrate 1, the bottom surface of the metal substrate 1 is provided with an air inlet opening 11, and both sides of the metal substrate 1 are provided with an air outlet opening 12. The two air outlet openings 12 communicate with the air intake opening 11; the top surface of the metal substrate 1 is also extended with a convex shell 13, and the inside of the convex shell 13 is filled with a piezoelectric ceramic layer 2; the metal substrate 1 A GaN buffer ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a self-cooling high-power integral LED package, which comprises a metal cooling base, wherein a plurality of LED epitaxial wafers are arranged on the metal cooling base; each LED epitaxial wafer comprises a metal substrate; an inlet opening is formed in the bottom surface of the metal substrate; outlet openings are formed in two side surfaces of the metal substrate; and the two outlet openings are communicated with the inlet opening. According to the self-cooling high-power integral LED package, the problem of integral package is solved; and through arrangement of cooling holes and cooling channels, the self-cooling function is achieved.

Description

technical field [0001] The invention relates to a self-radiating high-power integral LED package. Background technique [0002] At present, in the production of existing LEDs, the cost of LED chips accounts for more than half of the overall cost; reducing the size of blue LED chips, thereby reducing the overall production cost of LEDs, is currently a common approach adopted by most manufacturers. After the size of the LED chip is reduced, in order to keep the brightness unchanged, it is necessary to increase the current density input to the LED chip. In this way, under the premise of such a high-power current density, the applicant found after many experiments that it would cause two serious problems. First, the LED has a phenomenon of current suppression fading, that is, the higher the current density is, the lower the current density is. The lower the luminous efficiency of a high LED chip, the higher the current density, and the greater the energy loss. The second is th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/06
CPCH01L33/06H01L33/48H01L33/64H01L33/642
Inventor 严其艳刘勇求杨立波王华荣
Owner GUANGDONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap