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Electroplating equipment discharge control system and its control method

An electroplating equipment and control system technology, applied in the direction of circuits, electrolytic processes, electrolytic components, etc., can solve the problems of high manual operation intensity, low automation, and large human errors, and achieve accurate and orderly transmission, high automation, and responsiveness fast effect

Active Publication Date: 2018-05-22
DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has the following defects: firstly, the manual operation is intensive and human error is large; secondly, the degree of automation is low and the operation is inconvenient

Method used

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  • Electroplating equipment discharge control system and its control method
  • Electroplating equipment discharge control system and its control method

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0028] see figure 1 , is a structural schematic diagram of the discharge control system of the electroplating equipment of the present invention. During the discharge process, under the control of the discharge control system 1 of the electroplating equipment, the hanger 2 sequentially passes through the copper tank discharge station A, the automatic unloading station B, and the hanger clamping station along the discharge transmission direction. C and platform lifting station D. The hanger 2 is supported on a guide rail (not numbered) arranged along the direction of the discharging conveyance.

[0029] The discharge control system 1 of the electroplating equipment includes a detection unit 11 , a control unit 12 , a driving device 13 , a traction device 14 , a guide rail (not labeled), a rotating mechanism (not shown) and a lifting device 15 . The si...

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Abstract

The invention provides a material discharge control system for electroplating equipment. The discharge control system of the electroplating equipment includes a detection unit, a control unit, a driving device, a traction device, a rotating device and a lifting device. The detection unit is electrically connected to the control unit, and the driving device is electrically connected to the control unit. When the driving device works, it drives the traction device to move, and the traction device drives the hanger to move along the direction of material delivery. , the rotating mechanism rotates the hanger to the blanking angle, and the lifting device lifts in the vertical direction; the detection unit is used to detect the signals of each station, and the control unit controls according to the received detection signal The driving device works or stops working. Compared with the related art, the electroplating equipment discharge control method of the present invention has the advantages of high degree of automation, convenient operation and high control precision. Based on the electroplating equipment discharge control system, the present invention also provides a method for electroplating equipment discharge control.

Description

technical field [0001] The invention relates to the field of printed circuit board production, in particular to an electroplating equipment discharge control system and a control method thereof. Background technique [0002] With the continuous development of science and technology, the application of electronic products is becoming more and more extensive. As a necessary carrier of electronic products, the demand for printed circuit boards has also increased. Electroplating equipment is an important production equipment for printed circuit boards. The intelligence of electroplating equipment can not only improve production efficiency, but also reduce production costs for enterprises. Therefore, the realization of intelligent electroplating equipment is pursued by people. [0003] After the electroplating process is completed, it is an important link in the process of electroplating equipment to produce printed circuit boards after the rack unloads the material board, and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/12C25D17/00C25D7/12
Inventor 甘林林向武蔡志浩
Owner DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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