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Silicon wafer cleaning method and cleaning device

A cleaning device and a technology for cleaning silicon wafers, applied in sustainable manufacturing/processing, electrical components, climate sustainability, etc., can solve problems such as waste, citric acid cannot be completely dissolved, and silicon wafer attachments cannot be completely removed. The effect of saving water consumption and reducing production water

Inactive Publication Date: 2015-11-11
江苏奥能光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem is that the water temperature will drop over time
As a result, citric acid cannot be completely dissolved, and the attachments on the surface of the silicon wafer cannot be completely removed, which cannot be reused and causes unnecessary waste

Method used

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  • Silicon wafer cleaning method and cleaning device

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Embodiment Construction

[0021] The technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] ginseng figure 1 As shown, the cleaning device includes a soaking tank 1 and a heating device for heating the solution in the soaking tank. The top of the soaking tank 1 is sealed with a cover body 2 . An opening handle 3 is fixed on the top surface of the cover body 2 . A stirring device 4 is also installed on the soaking tank 1 .

[0023] In this technical solution, the heating device is used to heat the solution in the soaking tank and keep it in a...

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Abstract

The application discloses a silicon wafer cleaning method and cleaning device. The cleaning method comprises the following steps: (1) pouring citric acid and water into a constant-temperature soaking tank in a ratio of 3:100, and heating the mixture to 65+ / -5 DEG C; (2) performing stirring till the citric acid is fully dissolved; and (3) performing soaking under a constant-temperature for 2-3 hours. The silicon wafer cleaning method and cleaning device have the advantages that (1) lost citric acid can be increased by over 70 percent, and repeated soaking is available; (2) the waste water treatment pressure of an enterprise is relieved; and (3) the production water supply is reduced, and water and citric acid blended in a certain ratio can be reused, so that the water usage is saved.

Description

technical field [0001] The application belongs to the technical field of solar cell silicon wafer cutting, and in particular relates to a silicon wafer cleaning method and a cleaning device. Background technique [0002] At present, the traditional RCA cleaning method is difficult to remove the metal, organic contamination, and small particle pollutants attached to the silicon wafer during the cutting process. [0003] In order to completely remove the attachments on the surface of the silicon wafer, it is necessary to heat and soak the silicon wafer with citric acid. Citric acid is a strong organic acid with 3 H+ that can be ionized, and can be decomposed into various products after heating. Acid, alkali, glycerin and other reactions. Wash again. [0004] The existing soaking and backwashing method is to mix citric acid and hot water in a certain proportion and place them in a turnover box for soaking. The problem with that is that the water temperature drops over time. ...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/67H01L31/18
CPCH01L21/02052H01L21/67H01L31/18Y02P70/50
Inventor 李小勇
Owner 江苏奥能光电科技有限公司
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