Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multidimensional modeling method and simulation method for modular multilevel converter

A modular multi-level, multi-level converter technology, applied in the fields of instruments, electrical digital data processing, special data processing applications, etc., can solve the problems of inability to take into account simulation efficiency, transient analysis, accuracy, etc. Effects of Simulation Efficiency

Active Publication Date: 2015-11-11
XJ ELECTRIC +1
View PDF4 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to provide a multi-dimensional modeling method for a modular multi-level converter to solve the problem in the prior art that using a certain simulation model alone cannot take into account simulation efficiency, transient analysis, and accuracy

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multidimensional modeling method and simulation method for modular multilevel converter
  • Multidimensional modeling method and simulation method for modular multilevel converter
  • Multidimensional modeling method and simulation method for modular multilevel converter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] Example of modeling method

[0031] The following uses a half-bridge sub-module as an example for introduction. As other implementations, the modeling method of the present invention is also applicable to full-bridge or sub-modules of other topologies.

[0032] The structural diagram of a single bridge arm of a multi-dimensional model of a modular multilevel converter is shown in figure 1 shown. The modeling process is as follows:

[0033] ① Firstly, the high-speed equivalent model of the modular multilevel converter is established. Each sub-module in the modular multilevel converter can be summarized as being composed of an IGBT branch and a capacitor branch, wherein the IGBT branch includes an IGBT and its antiparallel diode DIODE. When a current flows through the IGBT branch, the branch is equivalent to the on-resistance R of the switching device on ; When no current flows through the IGBT branch, the branch is equivalent to the switch device turn-off resistance ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a multidimensional modeling method and a simulation method for a modular multilevel converter, comprising steps of: (1) establishing equivalent models of half-bridge submodules and establishing Thevenin equivalent models of submodules according to the Thevenin's Equivalence Theorem; cascading the Thevenin equivalent models of submodules to establish a high-speed equivalent model of a modular multilevel converter; (2) acquiring stray parameters, putting a stray capacitor and a stray resistor at corresponding positions in the high-speed equivalent model established in step (1), to establish a wide frequency model of the modular multilevel converter; and (3) replacing a submodule of each bridge arm of the wide frequency model established in step (2) with a detailed electromagnetic transient model, to establish a multidimensional model of the modular multilevel converter. The present invention can not only greatly improve the efficiency of system simulation and realize device-level electromagnetic transient analysis, but also simulate the effects of stray elements on system operation so as to facilitate efficient and accurate simulation analysis of the modular multilevel converter.

Description

technical field [0001] The invention relates to a multi-dimensional modeling method and simulation method for a modular multi-level converter. Background technique [0002] With the development of fully-controlled power electronic devices and the application of power electronic technology in power systems, the flexible DC transmission technology based on voltage source converters has been paid more and more attention. Modular multi-level converter is a kind of voltage source converter in the application of flexible direct current transmission system. It is composed of multiple half-bridge sub-modules connected in a certain way. By separately controlling the input of IGBT components of each sub-module The cut-off state makes the AC voltage output by the converter close to a sine wave, realizing efficient energy transmission. [0003] Due to the high number of levels of the modular multilevel converter, the system requires more components. Based on the detailed electromagneti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 吴金龙行登江张军王先为杨美娟张浩
Owner XJ ELECTRIC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com