A centering device before barrel grinding

Abstract

A centering device for a crystal bar before barrelling comprises a lower locating mechanism, a middle chuck mechanism for clamping the crystal bar, an upper locating mechanism and a stand column; the lower end of the stand column is fixed to one side of the lower locating mechanism, the upper locating mechanism is fixedly connected with the upper portion of the stand column through a suction cup base, the middle of the stand column is slidably provided with a sliding sleeve and a sliding sleeve braking assembly which controls the sliding sleeve to slide on the stand column in a sleeved manner, and the middle chuck mechanism is fixed with the sliding sleeve through a chuck fixing plate. According to the centering device for the crystal bar before the barrelling, the crystal bar is clamped through the middle chuck mechanism, then the upper locating mechanism and the lower locating mechanism are used for locating, and centering blocks bond at the two ends of the crystal bar, so that the problem that the experience technological requirements to operating staff for the crystal bar centering and bonding of the centering blocks are high is solved, the bad centering problem of the crystal bar and the centering blocks caused by subjective faults of the staff is effectively avoided, the production efficiency of products is greatly improved, the processing quality of the products is guaranteed, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of monocrystalline silicon wafer production, in particular to a centering device before rolling a crystal rod, which is used for centering the crystal rod and bonding centering blocks at both ends. Background technique [0002] Monocrystalline silicon wafers are the basic material for the IC industry and the solar industry. At present, the production of single crystal silicon wafers mainly relies on the Czochralski method (Czochralski method) to draw silicon single crystal rods, and then a series of processes such as cutting, rolling, slicing, chamfering, grinding, corrosion, cleaning and polishing. The steps are complete. After the silicon monocrystalline ingot is cut off, both ends of the ingot should be bonded and centered, so that the X-ray machine can accurately locate the crystal direction of the monocrystalline silicon crystal during tumbling, so that when the ingot is tumbling, it will be ground out according...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of not being able to accurately bond the ingot to the centering block in the prior art, the present invention provides a centering device before ingot rolling, which can avoid the problems caused by artificial subjective factors and objective experience. Eliminates poor centering bonding between the ingot and the centering block, which can ensure product quality and improve production efficiency

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