Method of using blue film to protect part of silicon dioxide film on silicon wafer surface

Abstract

Provided is a method of protecting part of a silicon dioxide film on the surface of a silicon chip by using a blue film. An acrylic acid sticker blue film is utilized to serve as a blue film for protecting a silicon dioxide layer, the redundant silicon dioxide layer is removed through corrosion of hydrogen fluoride and then the remaining silicon dioxide layer is immersed into an ammonium hydroxide solution that is usually used for cleaning a semiconductor, and the blue film is automatically separated from the surface of the silicon chip after a certain period of time. The blue film removing method is easy to operate, films can be removed in batch, and the production efficiency is greatly improved. No workers participate in the blue film removing operations, so the silicon chip is prevented from being contaminated and damaged by workers. Meanwhile, blue film glue that remains on the surface of the silicon chip can all be removed during the blue film removing process, the operations are reduced, and the costs are cut.

Description

technical field [0001] The invention relates to a method for protecting a silicon dioxide film at a specific position on the surface of a silicon chip in the field of semiconductor material processing, in particular to a method for using a blue film to protect a part of the silicon dioxide film on the surface of a silicon chip. Background technique [0002] There are many processes of using blue film in the process of semiconductor material processing, such as the use of blue film to protect the silicon dioxide layer in the back sealing technology of silicon polished wafer processing technology; in the device processing process, the blue film is covered on the wafer of the device Surface, to ensure that the surface of the wafer is not scratched during the subsequent circulation process. [0003] Chemical vapor deposition technology is used to deposit a layer of silicon dioxide film on the back of the silicon wafer to prevent doping impurities from the substrate from being in...

AI Technical Summary

Problems solved by technology

This method has a certain damage to the surface of the silicon wafer due to the use of a sharp thimble to pierce the surface of the silicon wafer, and the efficiency is low.