An automatic film transfer device and control method applied to semiconductor equipment

Abstract

The invention relates to an automatic wafer transfer device applied to a semiconductor device and a control method, and mainly solves the problems of relatively low efficiency and poor wafer transfer precision of an existing manual wafer transfer device, and poor mechanical arm rigidity, short life and not good enough wafer transfer precision existing in an automatic wafer transfer mode using a mechanical arm to bear a tray. The device is provided with a wafer transfer chamber door between a reaction chamber and a wafer transfer chamber, a cylinder is controlled through a wafer transfer door and opening and closing of the wafer transfer chamber door are controlled, thereby realizing opening and disconnection of a wafer transfer path. The control method utilizes a wafer transfer oar acting in a linear motion mode and a heating pedestal capable of executing lifting motion, and through a corresponding wafer transfer logic, achieves automatic water transfer of a tray bearing multiple wafers. The automatic wafer transfer device applied to the semiconductor device and the control method can improve the utilization rate of deposition equipment and process gas, are high in wafer transfer precision, and can be widely applied to the technical field of semiconductor film deposition application and manufacture.

Description

technical field [0001] The invention relates to an automatic film transfer device and a control method applied to semiconductor equipment. Specifically, it is a film transfer paddle that uses linear motion and a heating base that can perform lifting motion. Through the corresponding film transfer logic, automatic film transfer to the multi-wafer tray is achieved. The invention belongs to the technical field of semiconductor thin film deposition application and manufacture. Background technique [0002] Semiconductor equipment needs to send the wafer into the reaction chamber before the deposition reaction, and the wafer needs to be taken out of the reaction chamber after the deposition reaction is completed. In lab or R&D applications, larger size chambers are often used to deposit smaller size wafers. In order to make more effective use of deposition equipment and save resources such as reaction gases, a larger-sized tray is usually used to carry multiple small-sized wafe...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the above-mentioned problems, and mainly solve the problems of low efficiency and poor transfer accuracy of the existing large-size trays for placing multiple small-size wafers in manual transfer.

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