Packaging substrate and its manufacturing method and semiconductor package and its manufacturing method

Abstract

The invention provides a packaging substrate, a preparing method thereof, a semiconductor package and a preparing method thereof. The packaging substrate comprises the components of a layered body; a plurality of conductive components which are formed on the surface of the layered body; and a positioning structure which is formed on each corresponding conductive component, thereby settling a problem of positioning joint between packaging components in the vertical direction by means of the positioning structure, and improving manufacture yield and product quality.

Description

technical field [0001] The invention relates to a package substrate and a semiconductor package, in particular to a package substrate with improved yield, a semiconductor package and a manufacturing method thereof. Background technique [0002] With the evolution of semiconductor packaging technology, semiconductor packages have developed different packaging types, and various electronic products are increasingly required to be light, thin and small in size, so it can save the substrate plane area and take into account the processing performance at the same time Embedded package (embedded package) is getting more and more attention. [0003] Figures 1A to 1C In order to show the manufacturing method of the existing in-cell package. Such as Figure 1A As shown, a chip 12 is placed on the lower substrate 1 , and a plurality of conductive elements such as metal pillars 19 are formed on the surface of the lower substrate 1 around the chip 12 . [0004] Such as Figure 1B As...

AI Technical Summary

Problems solved by technology

[0006] However, in the existing manufacturing method of the semiconductor package, because the end surfaces of the metal pillars 19 are all flat, the alignment is not easy. However, even after the correct alignment, it is easy to carry out surface bonding of the metal pillars. The problem of sliding offset occurs, and finally makes the manufacturing yield low

Images