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Manufacturing method of flexible-rigid board

A technology of a rigid-flex board and a manufacturing method, which is applied in the manufacturing of printed circuits, electrical components, printed circuits, etc., can solve problems such as difficulty in opening the cover, and achieve the effects of preventing pollution and corrosion, being easy to implement, and having low production costs.

Inactive Publication Date: 2015-07-08
深圳市爱升精密电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, in view of the above-mentioned problems, the present invention proposes a cover-opening process of a soft-hard combination board, which improves the existing cover-opening technology, and opens the cover of the flexible board area before assembly to solve the problem of opening the cover later. difficult question

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  • Manufacturing method of flexible-rigid board
  • Manufacturing method of flexible-rigid board
  • Manufacturing method of flexible-rigid board

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Embodiment Construction

[0023] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0024] An example of an existing rigid-flex board is figure 1 and figure 2 shown. In this instance, see figure 1 , the rigid-flex board includes a first rigid board 1 (the first rigid board 1 is a double-sided rigid board with Layer11 and Layer12), a flexible board 2 (the flexible board 2 is a double-sided flexible board with Layer21, Layer23 and Bonding Layer21, Layer23 of Layer22), the second hard board 3 (the second hard board 3 is a double-sided hard board with Layer31 and Layer32) and bonding sheet 4, the first hard board 1, soft board 2 and the second The hard boards 3 are sequentially bonded and pressed together by the bonding sheets 4 . Existing waterproof technology generally adopts copper-clad laminates to drill slot holes, that is, to open slot holes 5 in the hard board area of ​​the first hard board 1 and the second hard board 3, so ...

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Abstract

The invention discloses a manufacturing method of a flexible-rigid board. The method comprises the steps that 1, a flexible board is manufactured, wherein a flexible board area is formed through base material feeding, graphic transfer, etching and demolding, brownification treatment is carried out on the flexible board area, a cover film is pasted on the flexible board area after treatment, the cover film is laminated to form a primary flexible board body, surface treatment and secondary brownification treatment are carried out on the primary flexible board body, and the flexible board is formed; 2, a pasting piece is manufactured, wherein a primary pasting piece body is formed through base material feeding and drilling, an uncovered area of the primary pasting piece body is windowed, and the pasting piece is formed; 3, a rigid board is manufactured, wherein a rigid board area is formed through base material feeding, drilling and graphic transfer, rigid board parts of copper-clad board areas are assembled together through the pasting piece, assembled copper-clad boards are pressed together to form a primary rigid board body, an uncovered area of the primary rigid board body is windowed, the rigid board is formed, and the windowing structure of the rigid board is identical to that of the pasting piece; 4, assembling is carried out, wherein the windowed rigid board, the pasting piece and the flexible board are assembled together in sequence.

Description

technical field [0001] The invention relates to the field of manufacturing a rigid-flex composite circuit board, and in particular provides a production process method for uncapping a rigid-flex composite circuit board. Background technique [0002] Rigid-flex board (also known as rigid-flex printed board or rigid-flex composite circuit board, hereinafter referred to as rigid-flex board) is a special interconnection technology that can reduce the assembly size and weight of electronic products and avoid wiring errors. Realize three-dimensional assembly under different assembly conditions, and have the characteristics of lightness, thinness, shortness, and smallness. It has been widely used in computers, avionics, 3G communication industries, and military electronic equipment. Complicated, high production cost and difficult to change and repair and other shortcomings. [0003] In the production process of rigid-flex boards, one of the difficult technologies is the cover-open...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36
CPCH05K3/361
Inventor 李伟正王萱
Owner 深圳市爱升精密电路科技有限公司
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