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Magnetron sputtering coating method and system

A magnetron sputtering coating and sputtering cavity technology, which is applied in sputtering coating, ion implantation coating, vacuum evaporation coating and other directions, can solve the problem of thin film layer, poor film uniformity and stability, display substrate The performance and quality are greatly affected, so as to achieve the effect of stable performance and unaffected film quality

Inactive Publication Date: 2015-03-11
HEFEI BOE OPTOELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of film formation, since the isolation area between the targets is a non-sputtering area, the film layer deposited on the substrate corresponding to the gap between the targets will be thinner, resulting in poor uniformity and stability of the film layer; especially For targets such as IGZO and ITO, if the film layer corresponding to the target gap is too thin, it will easily lead to defects such as mura (spot) in the display substrate, which will have a great impact on the performance and quality of the display substrate.

Method used

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  • Magnetron sputtering coating method and system
  • Magnetron sputtering coating method and system
  • Magnetron sputtering coating method and system

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Embodiment Construction

[0035] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0036] Embodiments of the present invention provide a magnetron sputtering film coating method and system, which can effectively improve the uniformity of magnetron sputtering film formation, thereby ensuring the performance and quality of a display substrate.

[0037] An embodiment of the present invention provides a magnetron sputtering coating system, including a sputtering chamber, and also includes:

[0038] A target group formed by splicing multiple targets;

[0039] a substrate carrier arranged opposite to the target group and used to carry the substrate to be film-formed;

[0040] A transmission device that drives the substrate carrier to reciprocate along the direction in which the targets are arranged.

[0041] In this embo...

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Abstract

The invention provides a magnetron sputtering coating method and system, belonging to the technical field of display. The magnetron sputtering coating system comprises a sputtering chamber, a target set, a substrate carrier and a transmission device, wherein the target set is arranged in the sputtering chamber and formed by splicing a plurality of targets; the substrate carrier is arranged opposite the target set and used for carrying a film-forming substrate; and the transmission device is used for driving the substrate carrier to reciprocate in the target arrangement direction. The technical scheme provided by the invention can effectively enhance the magnetron sputtering coating uniformity, thereby ensuring the performance and quality of the display substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a magnetron sputtering coating method and system. Background technique [0002] In the magnetron sputtering coating equipment of the 6th generation and above, due to the large size of the display substrate, multiple targets are generally spliced ​​to form a target group to form a sputtering film on the display substrate, and each target is controlled by a separate power supply , Different targets are relatively independent and insulated. In order to ensure the insulation and independence of each target, the targets must be isolated, and the isolation area between the targets is a non-sputtering area. [0003] In the process of film formation, since the isolation area between the targets is a non-sputtering area, the film layer deposited on the substrate corresponding to the gap between the targets will be thinner, resulting in poor uniformity and stability of the film layer; esp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
CPCH01J37/3417C23C14/086C23C14/3407C23C14/352C23C14/505C23C14/562H01J37/3447H01J37/3473H01J37/3488
Inventor 王效坤朴祥秀张勋泽王召波沙磊程贯杰张文俊王化露闻庆亮吕雷雷
Owner HEFEI BOE OPTOELECTRONICS TECH
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