Surface-mounted electronic device package structure and manufacturing and application methods thereof

Abstract

The invention provides a surface-mounted electronic device package structure comprising a plurality of surface-mounted electronic devices and a base strip; the surface-mounted electronic devices are evenly arranged side by side along the length of the base strip and are all fixed on the upper surface of the base strip through adhesive; the base strip and the surface-mounted electronic devices are made into a woven strip. The surface-mounted electronic device package structure is simple in structure and needs less packaging material; weldable portions of part of electrodes of the surface-mounted electronic devices are exposed out of the packaging material, and the packaging material need not be peeled off accordingly during mounting of the surface-mounted electronic devices; the surface-mounted electronic devices are fixed on the base strip and can be accurately conveyed to specific positions of a surface-mounter, and mounting efficiency is improved; the base strip which is split can be mounted with the surface-mounted electronic devices onto a circuit board and softens at the welding temperature to form a protective layer for the surface-mounted electronic devices, and the surface-mounted electronic devices and the circuit board are better in reliability.

Description

technical field [0001] The invention relates to the field of packaging and transportation of chip electronic components, in particular to a packaging structure of chip electronic components and its manufacturing method and usage method. Background technique [0002] With the development of science and technology and the improvement of electronic technology level, as well as the miniaturization of electronic products, the further improvement of performance and reliability, electronic components are developing in the direction of small, light and thin, and chip electronic components have emerged. device (SMD). Compared with ordinary components, chip electronic components cancel the electrode leads, which can be directly welded on the circuit board, and all the welding points are on a plane, especially suitable for the surface used in the automatic assembly process of circuit boards Mount Technology (SMT). [0003] Chip electronic components generally have three shapes: recta...

AI Technical Summary

Problems solved by technology

However, packing hundreds of chip electronic components in the same space without separation will inevitably cause mutual collision and friction between the components and between the components and the packaging box, especially for hard For components such as chip ceramic capacitors and chip inductors composed of high-quality ceramic bodies and soft metal electrodes, mutual friction will inevitably cause metal pollution on the surface of the ceramic body of the components, reduce the surface insulation performance of the components, and cause leakage of the components. or circuit board reliability issues

In addition, the chip electronic components stored in the plastic box may not be completely discharged, resulting in interruption of the placement machine supply

Due to the above problems, the method of using the plastic box packaging components has not been popularized so far

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