Rubber-sealed sensor and its manufacturing process

A manufacturing process and sensor technology, which is applied in the field of rubber-sealed sensors and its manufacturing process, can solve problems such as difficult to meet assembly accuracy, long sensor requirements, and large sensor size errors, so as to prevent the sensor head from bulging or cracking, and assembly Simple process and good sealing effect

Active Publication Date: 2017-07-07
UNITED AUTOMOTIVE ELECTRONICS SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in gearboxes and some special and complex application environments, the sensor is required to be relatively long, usually twice or even three times the length of the normal sensor, and the bracket shell sensor has a large dimensional error, which makes it difficult to meet the assembly accuracy requirements

Method used

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  • Rubber-sealed sensor and its manufacturing process
  • Rubber-sealed sensor and its manufacturing process
  • Rubber-sealed sensor and its manufacturing process

Examples

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Embodiment Construction

[0065] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0066] The glue-sealed sensor provided by the present invention can be used for active sensors and passive sensors, and is especially suitable for active sensors, such as Figure 7 As shown, it includes a bracket 1 , a Hall chip 2 , a circuit board 3 and an O-ring 4 .

[0067] Such as figure 2 As shown, the Hall chip 2 has a sensor element 21 and a chip PIN needle group 22, the sensor element 21 is located at the head of the Hall chip 2, and the Hall chip 2 is integrated with a magnet on the rear side of the sensor element 21, and the chip PIN The fixed end of the pin group 22 is close to the sensing element 21 , and the free end is bent towards the tail of the chip with a certain gap between it and the top surface 23 of the chip.

[0068] The circuit board 3 is a hard circuit board, including a substrate 31, a circuit board PIN pi...

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Abstract

The invention discloses a rubber-sealed sensor and its manufacturing process, which includes a bracket, a Hall chip and a circuit board; the bracket is integrally injection-molded with a connector plug and a connecting PIN needle group, and a cavity is formed near the sensing end. A chip cavity close to the sensing end is formed; the Hall chip is installed in the chip cavity, the front surface of the Hall chip is attached to the side of the chip cavity close to the sensing end, and several ribs are formed on the remaining sides of the chip cavity , the ribs are in interference fit with the remaining side surfaces of the Hall chip, the circuit board is installed in the cavity and the bottom surface is attached to the bottom surface of the cavity, and the cavity is filled with insulating sealant to package the circuit board and the Hall chip. In the present invention, the interference fit between the chip and the convex ribs in the chip cavity not only makes it easy to ensure that the chip is installed to the bottom, but also makes the front surface of the chip and the side of the chip cavity close to the sensing end fit together, ensuring the sensing of breath, and at the same time, the glue fixation is effective Prevent the sensor head from bulging or breaking due to excessive installation pressing force, and ensure the installation position of the chip.

Description

technical field [0001] The invention relates to the manufacturing technology of automobile sensors, in particular to a rubber-sealed sensor and its manufacturing process. The rubber-sealed sensor can be used in automobile engines, gearboxes and ABS anti-lock braking systems. Background technique [0002] At present, sensors used in automobile engines, gearboxes and ABS anti-lock braking systems include passive and active sensors. Passive sensors are called passive sensors and active sensors are called active sensors. Compared with passive sensors, active sensors have the advantages of small size, light weight, high integration, fast response, and strong anti-interference ability, so they are more and more widely used. [0003] There are mainly two molding methods for existing active sensors. [0004] One is the overall injection molding type, that is, the integrated circuit element packaged with the Hall chip is connected with the PIN pin or the wiring harness containing t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01D11/00G01D11/26
Inventor 何元飞孙广建程捷陈中明
Owner UNITED AUTOMOTIVE ELECTRONICS SYST
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