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Film treating apparatus

A film processing and film layer technology, applied in lamination devices, identification devices, thin material processing, etc., can solve the problems of ACF dirtying and increasing the time to replace ACF

Active Publication Date: 2014-11-26
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This increases the time required to replace the ACF and causes the ACF to become dirty

Method used

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  • Film treating apparatus
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Embodiment Construction

[0020] The aspects and features of the present invention and methods for achieving the aspects and features will become apparent by referring to the embodiments to be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed hereinafter, but can be implemented in various forms. Matters defined in the specification, such as detailed structures and elements, are merely provided to help those of ordinary skill in the art fully understand the specific details of the present invention, and the present invention is limited only within the scope of the appended claims.

[0021] The term "on" used to indicate that an element is on another element or on a different layer or on a layer includes a case where an element is directly on another element or a layer, and an element is located via another layer or a further element. Both when located on another component. Throughout the description of the inventi...

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PUM

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Abstract

A film treating apparatus includes a film feeder configured to feed a film having first and second surfaces, a film processor configured to process the film fed from the film feeder, a film collector configured to collect the film processed by the film processor, a fixed support unit configured to support at least one of the first or second surface of the film and to guide the movement of the film, and a variable support unit configured to apply tension to the film while moving from the first surface of the film toward the second surface of the film.

Description

technical field [0001] The present invention relates to film processing apparatus, and more particularly to film processing apparatus comprising one or more rolls. Background technique [0002] In general, the process of manufacturing a flat panel display (FPD) such as a liquid crystal display (LCD), a plasma display (PDP), etc., involves driving an integrated circuit (IC ) or the process of combining flexible printed circuit (FPC) and substrate. [0003] The ACF includes a viscous binder resin and fine conductive particles uniformly dispersed in the binder resin. The ACF can be thermally compressed so that the electrodes are electrically connected to each other with conductive particles interposed between them. In addition, the adhesive resin can be cured by heating the ACF, so that the driving circuit can be fixed to a liquid crystal panel or a printed circuit board (PCB). [0004] Various ACF attachment devices have been developed in which a driver IC or FPC and a subs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
CPCB65H23/02B05D3/12B32B38/00B32B37/0053B65H16/00B32B38/18B32B2037/243B32B2457/20B65H18/103B65H23/26B65H2801/61Y10T156/17G09F9/00B32B37/22B65H20/02
Inventor 洪东湖
Owner SAMSUNG DISPLAY CO LTD
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