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Method and system for simultaneously measuring heat conductivity, heat diffusivity and heat capacity of low-dimensional material

A technology of thermal diffusivity and low-dimensional materials, applied in the field of thermal testing of low-dimensional materials

Active Publication Date: 2014-11-19
TSINGHUA UNIV
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Problems solved by technology

[0007] In order to solve the problem of simultaneously measuring the thermal diffusivity, heat capacity and thermal conductivity of low-dimensional materials and improve the measurement accuracy, the present invention proposes a method and system for in-plane or axial thermal testing of low-dimensional materials

Method used

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  • Method and system for simultaneously measuring heat conductivity, heat diffusivity and heat capacity of low-dimensional material
  • Method and system for simultaneously measuring heat conductivity, heat diffusivity and heat capacity of low-dimensional material
  • Method and system for simultaneously measuring heat conductivity, heat diffusivity and heat capacity of low-dimensional material

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specific Embodiment approach

[0068] The advanced nature of this method is first reflected in the simultaneous measurement of in-plane or axial thermal conductivity, thermal diffusivity, and heat capacity of low-dimensional materials. The specific implementation is as follows:

[0069] Such as figure 1 As shown, a system for simultaneously measuring thermal conductivity, thermal diffusivity and heat capacity of low-dimensional materials is proposed, including vacuum chamber, heat sink, thermoelectric module, water cooling module, fixture, infrared temperature measuring probe, signal generator, signal Amplifier, lock-in amplifier, data collector, computer; among them, the fixture in the vacuum chamber clamps one end of the object to be tested, and the fixture is connected to the heat sink through the thermoelectric module; the signal generator is connected to the lock-in amplifier through the signal amplifier, and the phase-lock The amplifier is connected to the computer through the data collector, and the...

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Abstract

The invention belongs to the technical field of heat testing of low-dimensional materials and in particular relates to a method and a system for simultaneously measuring the heat conductivity, heat diffusivity and heat capacity of a low-dimensional material. According to the system, a frequency-variable periodic wave type heat source assembly is used as a sine wave heat source; temperature signals of different parts of a sample are collected by using an infrared temperature measurement probe in a non-contact manner; periodic wave type signals with signal-noise ratios are collected by using a phase-locking amplifier in double channels; a computer is used for processing the signals and analyzing data; the heat conductivity, the heat diffusivity and the heat capacity can be simultaneously measured. According to the method, a novel analytic method is disclosed by adding a frequency variable on the basis of an Angstrom method, so that one set of device is capable of simultaneously measuring the heat conductivity, the heat diffusion coefficient and the heat capacity change; a reference quantity heat dissipation term m<2> is increased, so that a real part m<2> is added to the square beta<2> of an amplitude attenuation coefficient; the accuracy and the reliability of the complete set of analytic method in actual use are greatly improved.

Description

technical field [0001] The invention belongs to the technical field of thermal testing of low-dimensional materials, in particular to a method and system for simultaneously measuring thermal conductivity, thermal diffusivity and heat capacity of low-dimensional materials. Background technique [0002] The testing methods for thermal conductivity of materials currently used can be roughly divided into two categories: steady-state method and transient method. Among them, the steady-state method is based on various tools of ASTM5470, which is suitable for measuring isotropic materials. For flat sheet materials, only the thermal conductivity between the upper and lower surfaces can be measured. If the measurement object is an anisotropic two-dimensional planar material such as graphite sheet, the in-plane thermal conductivity and the interlayer thermal conductivity have a difference of hundreds of times, and the steady-state method cannot accurately measure the in-plane thermal...

Claims

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Application Information

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IPC IPC(8): G01N25/20
Inventor 祝渊陈克新
Owner TSINGHUA UNIV
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