A micro-warpage detection method for small ring parts
A detection method, a ring technology, applied to measuring devices, instruments, and optical devices, etc., can solve the problems that are not suitable for the rapid detection of small ring parts
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[0018] The specific implementation manner of the patent of the present invention will be described in detail below in conjunction with the technical scheme and accompanying drawings.
[0019] For the small ring part 3 with an outer diameter of 6mm, an inner diameter of 5mm, and a thickness of 0.2mm, the micro-warpage rapid detection is performed.
[0020] Place the surface 2 on the silicon wafer as the mirror plane, and use SU-8 glue photolithography on it to make a diameter of boss. The thickness of the SU-8 glue is 0.15mm, and this part is used as the positioning column 4 when the small ring part 3 is placed.
[0021] Place the small ring part 3 on the positioning column 4, at this time, the center of the small ring part 3 coincides with the center of rotation of the rotary platform 1. Adjust the displacement platform 7, drive the industrial CCD camera 5 fixed on it to align with the gap 2 between the small ring part 3 and the mirror image placement surface, adjust the fo...
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