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Package for thin type products and packing method thereof

A technology of thin products and packaging methods, which is applied in packaging and other directions, can solve problems that affect product yield, sheet products cannot be automatically dropped, and component products are difficult to locate accurately, and achieve the effect of improving automated production efficiency and product yield

Inactive Publication Date: 2014-10-01
SHENZHEN EVERWIN PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The carrier tape is usually made of plastic material through a molding process. During the molding process, due to the limitation of the technical level, a certain R angle will be generated on the side of the packaging groove so that the bottom of the packaging groove is wide and the opening is slightly narrower. , after some thinner sheet-like component products are loaded into the packaging tank, the component products will be dislocated at the bottom of the packaging tank, and the following problems will occur in the automated production process: as in the SMT process, the Parts and components are difficult to locate accurately, which affects product yield; and may cause sheet products on the carrier tape to fail to fall automatically.

Method used

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  • Package for thin type products and packing method thereof
  • Package for thin type products and packing method thereof
  • Package for thin type products and packing method thereof

Examples

Experimental program
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Embodiment Construction

[0011] see Figure 1 to Figure 3 As shown, the thin product package of the present invention includes a carrier tape 10 , an upper cover tape 20 and a lower cover tape 30 respectively sealed on the upper and lower sides of the carrier tape 10 .

[0012] The carrier tape 10 is made of plastic material through a molding process, and is in the shape of a long strip, the length of which depends on the quantity of product packaging. The carrier tape 10 includes a base portion 11 and a positioning portion 13 disposed at one lateral end of the base portion 11 . The base 11 is uniformly provided with a plurality of packaging grooves 12 for packaging thin products 40 , and the packaging grooves 12 penetrate the base 11 in the up-down direction. The positioning portion 13 is provided with a plurality of positioning holes 14 . While the plastic material is being molded into the carrier tape 10 . Due to the mold, a rough surface is formed on the bottom surface 16 of the carrier tape 10...

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Abstract

A package for thin type products comprises a carrier band, an upper cover band and a lower cover band. The carrier band comprises a base part and a fixed part formed on one side of the base part. The base part is provided with a plurality of packing grooves penetrating the base part in the vertical direction and used for packing the thin type products, the lower cover band covers the bottom surface of the carrier band so as to cover the packing grooves from above, and the upper cover band covers the top surface of the carrier band so as to cover the packing grooves from below. The package for the thin type products can greatly improve automatic production efficiency and product yield.

Description

technical field [0001] The invention relates to the field of product packaging, in particular to a thin product packaging and a packaging method thereof. Background technique [0002] In the highly automated electronics field, the packaging of all products should adapt to the requirements of highly automated production. In order to meet the needs of automatic production, the traditional small product packaging is generally set up as a strip carrier tape structure. The carrier tape is provided with a number of evenly arranged packaging slots for packaging electronic products. The products are placed in the packaging After being in the groove, a cover tape is covered on the carrier tape by heat sealing to realize the packaging of the product. The carrier tape is usually made of plastic material through a molding process. During the molding process, due to the limitation of the technical level, a certain R angle will be generated on the side of the packaging groove so that the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D73/02B65B15/04
Inventor 韦冬秀陈爱林
Owner SHENZHEN EVERWIN PRECISION TECH
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