Computer cooling device

Abstract

The invention relates to a computer cooling device. The computer cooling device comprises a plurality of annular cooling metal fins; each annular cooling metal fin comprises a base, a heat absorbing layer, a heat-conducting layer and a cooling layer, wherein the heat absorbing layer, the heat-conducting layer and the cooling layer are all arranged on the base, the heat absorbing layer is located at the center of the base, the heat-conducting layer covers the heat absorbing layer, the cooling layer covers the heat-conducting layer; the base and the heat absorbing layer are made of the same materials which include 20%-40% of silicon, 30%-50% of copper, 5%-15% of gold and 10%-30% of aluminum in percentage by weight, and all the materials are evenly mixed together and then molded in a die-casting manner; the heat-conducting layer is made of materials including 20%-60% of aluminum and 40%-80% of copper in percentage by weight, and the materials are evenly mixed together and then molded in a die-casting manner; the cooling layer is made of aluminum. The computer cooling device is good in cooling effect and low in cost.

Description

technical field [0001] The invention relates to the field of computers, in particular to a computer cooling device. Background technique [0002] The use of computers has been greatly popularized, but the heat dissipation performance of computers is the most concerned point of most users. In hot summer, or in areas with concentrated work density, such as Internet cafes, dense workplaces, etc., it is easy to make the computer itself heat up. , When it is in a high temperature state for a long time, it is easy to make the computer blue screen, or burn the internal electronic components, resulting in the loss of important files, heavy losses, and the need for repairs, wasting costs and resources. [0003] In the prior art, people use the cooperation of aluminum substrates and fans to dissipate heat. However, as we all know, although the cost of aluminum is low, its thermal conductivity is not the best, and it cannot efficiently transmit the temperature on the computer hardware....

AI Technical Summary

Problems solved by technology

[0002] The use of computers has been greatly popularized, but the heat dissipation performance of computers is the most concerned point of most users. In hot summer, or in areas with concentrated work density, such as Internet cafes, dense workplaces, etc., it is easy to make the computer itself heat up. , when it is in a high temperature state for a long time, it is easy to make the computer blue screen, or burn the internal electronic components, resulting in the loss of important files, heavy losses, and the need for repairs, wasting costs and resources

[0003] In the prior art, people use the cooperation of aluminum substrates and fans to dissipate heat. However, as we all know, although the cost of aluminum is low, its thermal conductivity is not the best, and it cannot efficiently transmit the temperature on the computer hardware. , so that after long-term use, the hardware cannot be effectively transmitted due to temperature, resulting in burning

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