Flexible circuit board and optical module with said flexible circuit board

Abstract

The present invention provides a flexible circuit board. The flexible circuit board includes at least two circuit layers and an insulating layer between every two circuit layers. Each circuit layer includes a metal layer and a cover film covering the metal layer. The insulating layer is stacked with the metal layers of every two circuit layers, at least one of the circuit layers is recessed with a bending area, and the bending area is formed on the metal layer or the circuit layer. The invention also provides an optical module with the flexible circuit board.

Description

technical field [0001] The invention relates to a flexible circuit board and an optical module with the flexible circuit board. Background technique [0002] With the development of science and technology, flexible circuit boards (FPC, Flexible Printed Circuit) as the connection method between optical devices in optical modules and printed circuit boards (PCB, Printed Circuit Board) have increasingly become a mainstream trend. However, as optical modules become more and more miniaturized, high-speed, and high-density, the overall size requirements for FPCs are also getting smaller and smaller, resulting in poor flexibility of FPCs, which will easily cause optical devices and PCBs to appear after they are assembled in the module. The open circuit problem of FPC bending breaks, which causes module failure; at the same time, for high-speed FPC, the copper layer cannot be designed with grid copper, which increases the difficulty of FPC bending. Contents of the invention [00...

AI Technical Summary

Problems solved by technology

However, as optical modules become more and more miniaturized, high-speed, and high-density, the overall size requirements for FPCs are also getting smaller and smaller, resulting in poor flexibility of FPCs, which will easily cause optical devices and PCBs to appear after they are assembled in the module. The open circuit problem of FPC bending breaks, which causes module failure; at the same time, for high-speed FPC, the copper layer cannot use grid copper design, which increases the difficulty of FPC bending

Images