Double-sided adhesive tape, manufacturing method thereof and method of adhering double-sided adhesive tape to FPC (Flexible Printed Circuit) product

Abstract

The invention relates to a technology of adhering a double-sided adhesive tape to an FPC (Flexible Printed Circuit) product and discloses a manufacturing method of the double-sided adhesive tape. The manufacturing method comprises the following steps: utilizing secondary punching (cutting) and two layers of self-prepare release paper to prepare the double-sided adhesive tape and thus conveniently adhering the doubled-sided adhesive tape to the FPC product in a strip shape. The invention discloses the double-sided adhesive tape. The double-sided adhesive tape is manufactured by the method and comprises a three-layer superposition structure which respectively comprises an original release paper at the lower layer, a double-sided adhesive tape layer at the middle layer and a secondary self-prepare release paper at the upper layer, wherein the front surfaces of the original release paper and the secondary self-prepare release paper are in a strip pasting integral shape, and the front surface of the double-sided adhesive tape layer is in a shape of an adhesive region of the release paper. The invention also discloses a method of adhering the double-sided adhesive tape to the FPC product. The method comprises the following steps: entirely removing the secondary self-prepare release paper at the upper layer, and then correspondingly adhering the double-sided adhesive tape layer to the set region on each unit sheet on the FPC product. By virtue of the method, the efficiency of adhering the double-sided adhesive tape to the FPC product can be improved.

Description

technical field [0001] The invention relates to the field of manufacturing FPC products, in particular to a process for pasting double-sided adhesive tape on FPC products. Background technique [0002] In some FPC products that FPC manufacturers supply to electronic product manufacturers or electronic assembly manufacturers, they will be required to stick double-sided tape on the FPC products for subsequent assembly. refer to figure 1 with figure 2 As shown, it is necessary to paste a piece of double-sided tape on a set area of ​​the flexible circuit board 1 (FPC). A piece of double-sided tape pasted on the flexible circuit board 1 usually has a release paper handle 22 so that the release paper 2 can be easily peeled off before pasting. Specifically, there is a double-sided adhesive layer 3 on the back of the release paper adhesive area 21 of the double-sided adhesive tape, and the release paper handle 22 has no double-sided adhesive layer 3, and is pasted on the flexibl...

AI Technical Summary

Problems solved by technology

[0004] When the operator uses the prepared double-sided tape to paste FPC products, although the entire double-sided tape can be pasted on the FPC imposition to improve work efficiency (compared to the early single-piece double-sided tape pasting operation method) , but before the pasting operation, it is necessary to remove the self-prepared release paper 4 on the double-sided adhesive layer 3 corresponding to the set pasting area of ​​each flexible circuit board unit board one by one. It is very inconvenient to remove the release paper fragments at the same time, and the work efficiency is still not efficient enough

At the same time, the sticking operation will also cause the release paper fragments to be everywhere, which affects environmental sanitation and is not easy to clean

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