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Heat dissipation waterproof structure and set top box thereof

A technology of waterproof structure and heat dissipation holes, which is applied to the structural parts of electrical equipment, cooling/ventilation/heating transformation, electrical components, etc. The effect of preventing water from entering the inside of the equipment and avoiding short-circuiting of the equipment

Inactive Publication Date: 2014-07-02
SHENZHEN JIUZHOU ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation holes of existing electronic equipment are all directly opened on the casing in the form of through holes or dust-proof holes. The entire heat dissipation structure cannot be disassembled and has a waterproof function. When water flows onto the casing, It will flow directly from the heat dissipation hole to the motherboard, causing a short circuit and the risk of damage to electronic equipment

Method used

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  • Heat dissipation waterproof structure and set top box thereof
  • Heat dissipation waterproof structure and set top box thereof
  • Heat dissipation waterproof structure and set top box thereof

Examples

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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] Such as Figure 1 to Figure 3 As shown, a heat dissipation and waterproof structure 1 provided by the embodiment of the present invention includes an upper cover 11 and a top cover 12. The upper cover 11 is provided with a ventilation window 111 for ventilation, and the top cover 12 is set above the ventilation window 111. And it is detachably connected with the upper cover 11 through a connection assembly, a heat dissipation gap 14 for heat dissipation and ventilation is formed between the upper cover 11 and the top cover 12, and the upper cover 11 located below the top cover 12 is provided...

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PUM

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Abstract

The invention relates to the technical field of heat dissipation structures, and discloses a heat dissipation waterproof structure and a set top box of the heat dissipation waterproof structure. The heat dissipation waterproof structure comprises an upper cover and a top cover, wherein the upper cover is provided with a ventilation window used for ventilation; the top cover is arranged above the ventilation window and is detachably connected with the upper cover through a connecting assembly; a heat dissipation interval used for heat dissipation and ventilation is formed between the upper cover and the top cover; the upper cover below the top cover is provided with heat dissipation holes and a waterproof assembly. The set top box comprises the heat dissipation waterproof structure. The heat dissipation waterproof structure is attractive in appearance, good in heat dissipation, good in waterproof effect, capable of being detached and convenient to maintain. The use reliability and safety of the set top box provided with the heat dissipation waterproof structure are improved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation structures, and in particular relates to a detachable heat dissipation and waterproof structure and a set-top box thereof. Background technique [0002] With the rapid development of electronic communication technology, electronic equipment has also been widely used. Various fields need to use corresponding electronic equipment to realize corresponding functions, such as TV set-top boxes and routers used in homes. When they work normally, they all need to dissipate heat to ensure their normal working conditions. Therefore, the casings of existing electronic equipment are all provided with heat dissipation holes for heat dissipation. However, the heat dissipation holes of existing electronic equipment are all directly opened on the casing in the form of through holes or dust-proof holes. The entire heat dissipation structure cannot be disassembled and has a waterproof function. When water...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K5/06H04N21/41
CPCH05K7/20127H05K5/0214
Inventor 唐志飞
Owner SHENZHEN JIUZHOU ELECTRIC
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