Environmental stress screening method of electronic device by using stepping stress

Abstract

The invention discloses an environmental stress screening method of an electronic device by using stepping stress. A screening system comprises a temperature box, a vibrating table and a test device. According to the method, electronic devices which are invalid early are removed by using stepping stress, and a mode of only exerting constant temperature circulation or constant vibration stress in a previous screen method is changed; meanwhile, a combined stress screening method is firstly adopted. By exerting environment screening stress of stepping stress and combined stress to the electronic device, the screening validity and the screening effect of environmental stress are effectively increased. The environmental stress screening method is successfully implemented in a product of a certain type, the delivered electronic device passes the check of actual application, which proves the validity and the applicability of the control method; thus, the environmental stress screening method has strong generalization performance during the production process of electronic devices.

Description

technical field [0001] The invention relates to a method for screening environmental stress of electronic equipment, in particular to a method for screening environmental stress of electronic equipment with step stress. Background technique [0002] After the electronic equipment comes off the product line and before it is delivered to the user, it is necessary to implement environmental stress screening to eliminate early failures. Most of these early failures are caused by the defects of electronic components and the defects introduced into the products during the production and assembly process. From the perspective of ensuring the reliability of the product in use, there must be a method that can eliminate these defects. The more realistic and feasible method is to use environmental stress screening technology to stimulate early product failure by simulating or increasing the environmental stress in the process of product use. , and introduce this process as a process i...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for screening environmental stress on electronic equipment with step stress, so as to improve the low screening efficiency and insufficient screening effect of the previous environmental stress screening method

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