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Shell structure

A casing and shell technology, applied in the direction of casing/cabinet/drawer parts, digital processing power distribution, etc., can solve problems such as easy falling off

Inactive Publication Date: 2014-05-07
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although this method is relatively simple, it is easy to fall off due to external factors such as temperature or humidity
Also, when only the case is replaced, an additional label must be provided and reattached

Method used

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Embodiment Construction

[0037] figure 1 and figure 2 Each is a partial schematic view of the casing structure of the embodiment of the present invention, which are drawn from different viewing angles. image 3 Yes figure 1 Exploded view of the chassis structure. Please also refer to Figure 1 to Figure 3 , in this embodiment, the casing structure 10 is, for example, a computer mainframe, which is used to accommodate electronic components (not shown), but this embodiment is not limited thereto.

[0038] The casing structure 10 includes a casing 100 , a guide 200 and a label 300 . The housing 100 includes an outer shell 110 and an inner shell 120 assembled with each other, wherein the inner shell 120 is made of metal to serve as the main supporting structure of the casing structure 10 . The outer shell 120 is made of plastic material, and covers the inner shell 120 as an appearance part of the casing structure 10 . Furthermore, after the inner shell 120 and the outer shell 110 are assembled, a s...

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PUM

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Abstract

The invention provides a shell structure, which comprises a shell, guide pieces and a label. The shell has interlayer space; the guide pieces are arranged in the interlayer space; the label is provided with sliding grooves; the guide pieces are coupled in the sliding grooves in a sliding mode so as to enable the label to move relatively to the shell to move out of the interlayer space or move into the interlayer space.

Description

technical field [0001] The present invention relates to a casing structure, and in particular to a casing structure with labels. Background technique [0002] Traditionally, there are many ways to form labels on the case, such as using sputtering, electroplating, chemical plating, etc. to form labels directly on the case, but this method takes a long time and costs a lot. Another way is to make additional labels and attach them to the case. However, although this method is relatively simple, it is easy to fall off due to external factors such as temperature or humidity. Furthermore, when only the casing is replaced, another additional label must be provided and reattached. Accordingly, it is necessary to develop a new labeling technology to improve the problems existing in the traditional technology, and at the same time facilitate industrial production. Contents of the invention [0003] The invention provides a casing structure with labels that are easy to disassemble...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02G06F1/18
Inventor 吴建勋
Owner INVENTEC PUDONG TECH CORPOARTION
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