MEMS microstructure plane displacement measuring method

A technology of displacement measurement and microstructure, which is applied in the direction of measuring devices, special data processing applications, instruments, etc., can solve the problems that the measurement resolution cannot meet the requirements of MEMS microstructure planar motion measurement, and the calculation amount is large, so as to improve the accuracy and high The effect of precision measurements

Inactive Publication Date: 2014-05-07
CHONGQING UNIV OF POSTS & TELECOMM
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention aims at the defects of the traditional phase correlation method that the calculation amount is large, and the measurement resolution cannot meet the measurement requirements of the MEMS microstructure plane motion.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MEMS microstructure plane displacement measuring method
  • MEMS microstructure plane displacement measuring method
  • MEMS microstructure plane displacement measuring method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] By adopting the method of the present invention, the influence of different lighting on the collected images is avoided; since the rank of the phase correlation matrix of the image is one without noise interference, the singular value decomposition technology is introduced to reduce the amount of calculation in the phase correlation measurement method, and the linearity obtained The phase coefficient uses fractal interpolation to reduce noise and improve the measurement accuracy. The least square method is used to fit the linear phase coefficient of the singular vector to obtain the slope of the fitted line to achieve high-precision MEMS microstructure plane displacement measurement.

[0014] Below in conjunction with accompanying drawing and specific examples the implementation of the present invention will be described as necessary, as figure 1 It is a flow chart of MEMS in-plane displacement measurement in the present invention. Including the following steps:

[001...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a MEMS microstructure plane displacement measuring method integrating fractal interpolation and singular value decomposition, and relates to image phase correlation technologies and the field of MEMS dynamic measurement. According to the MEMS microstructure plane displacement measuring method integrating fractal interpolation and singular value decomposition, a traditional phase correlation method is improved, the defects that according to the traditional phase correlation method, the calculated amount is large, and the measuring resolution is insufficient are overcome, and rapid high-precision measurement of the MEMS microstructure plane movement displacement is achieved.

Description

technical field [0001] The invention belongs to the technical field of MEMS dynamic measurement. It specifically involves MEMS planar displacement measurement methods of fractal interpolation and singular value decomposition. Background technique [0002] Micro-electro-mechanical systems (MEMS: Micro-electro-Mechanical Systems) is a multidisciplinary frontier research field developed on the basis of microelectronics technology, involving micromechanics, microelectronics, automatic control, physics, chemistry, biology and materials Science and other engineering technology and science. The development of MEMS technology has opened up a new technical field and industry. Micro-sensors, micro-actuators, micro-components, micro-mechanical optical devices, vacuum microelectronic devices, power electronic devices, etc. made by MEMS technology are small in size, light in weight, Low power consumption, strong reliability, easy intelligence, digitalization and other advantages, so it...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/02G06F19/00G01C25/00
Inventor 罗元张毅计超胡章芳郝宏刚
Owner CHONGQING UNIV OF POSTS & TELECOMM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap