Vertical oxidizing furnace process door cooling method and device used in wet oxidation process

Abstract

The invention discloses a vertical oxidizing furnace process door cooling method and device used in a wet oxidation process. According to the method and device, the wet oxidation process is divided into a high temperature interval, a middle temperature interval and a low temperature interval based on the requirement of a wet oxidation process result according to different main process temperatures, a control module of the device is used for setting process doors with different flow ranges from large to small and the circulating cooling water flow of the bottom of a furnace body according to the three different temperature intervals, the flows of circulating cooling water pipelines of the process doors are adjusted through a flow controller according to a detected temperature value of a thermocouple in the process, so that the process result is guaranteed, and sealing parts of the process doors are not damaged. The method and device are simple in operation, cost is not increased, and equipment is well maintained.

Description

technical field [0001] The present invention relates to a cooling method and a cooling device for a process door of a semiconductor vertical oxidation furnace, more specifically, to a cooling method and corresponding cooling water flow differential control for the process door of a vertical oxidation furnace in a wet oxygen process cooling control device. Background technique [0002] The gas transmission system of the semiconductor vertical oxidation furnace adopts the gas supply and discharge mode of upper air intake and lower exhaust. Wherein, the exhaust pipeline is located at the lower part of the furnace tube, close to the process door. [0003] see figure 1 and figure 2 , figure 1 It is a structural schematic diagram of the carrier and sealing mechanism in a semiconductor vertical oxidation furnace; figure 2 yes figure 1 The top view of the process door sealing mechanism in . Such as figure 1 As shown, in the process, in order to ensure a good thermal field,...

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Problems solved by technology

[0013] The disadvantages of the above two methods are: to change the heat capacity of the heat preservation barrel, hardware modification is required. The heat preservation barrel is made of quartz material. Generally, the heat preservation barrel has an integrated structure and cannot be disassembled, and the cost of reprocessing is relatively large; while the process temperature is based on production. It depends on the demand and cannot be changed at will. Adjusting the process temperature will inevitably affect the final production capacity

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