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Modified urea-formaldehyde glue for solid wood composite floor substrate composite board and preparation method thereof

A technology of solid wood composite flooring and modified urea-formaldehyde, which is applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesives, adhesive types, etc., and can solve the problems of high curing temperature, slow speed, and strict requirements on the moisture content of the veneer, etc. problems, to achieve the effect of easy operation and quality assurance

Active Publication Date: 2017-05-03
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the phenolic resin adhesive is used, good results can be obtained, but the price of phenolic adhesive is relatively high, and the curing temperature is high and the speed is slow, and the requirements for the moisture content of the veneer are very strict.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] 1. Formula composition (the "parts" referred to in the following examples are all parts by weight, and the concentration is measured by weight concentration)

[0022] 550 parts of formaldehyde solution with a concentration of 37%, 314 parts of urea (purity is agricultural grade), 70 parts of melamine (purity is industrial grade), 1.6 parts of polyvinyl alcohol (purity is 99%), 3 parts of dicyandiamide (purity is industrial grade) class).

[0023] 2. Glue making process

[0024] Put 550 parts of formaldehyde solution with a concentration of 37% and 1.6 parts of polyvinyl alcohol into the reaction kettle, start the agitator, start heating and heating, stop heating when the temperature rises to 38-40°C, and when the temperature inertia rises to 45°C, use 27-30% hydrochloric acid to adjust the pH value to 1.5;

[0025] When the temperature rises to 45°C, add 126 parts of the first batch of urea evenly, control the temperature to rise to 70-76°C, and react for 30 minutes;...

Embodiment 2

[0036] 1. Formula composition

[0037] 520 parts of formaldehyde solution with a concentration of 37%, 300 parts of urea (purity is agricultural grade), 120 parts of melamine (purity is industrial grade), 1 part of polyvinyl alcohol (purity is industrial grade), 0.1 part of hexamethylenetetramine ( Purity is industrial grade).

[0038] 2. Glue making process

[0039] Put 520 parts of formaldehyde with a concentration of 37% and 1 part of polyvinyl alcohol into the reaction kettle, start the agitator, start heating and heating, stop heating when the temperature rises to 38-40 °C, and when the temperature inertia rises to 45 °C, use 31 ~36% hydrochloric acid to adjust the pH value to 1.8;

[0040] When the temperature rises to 45°C, add 130 parts of the first batch of urea evenly, and control the temperature to rise to 70-72°C;

[0041] Immediately adjust the pH to 4.2 with 25-30% sodium hydroxide aqueous solution, add 40 parts of melamine, add the second batch of 158.9 par...

Embodiment 3

[0051] 1. Formula composition

[0052] 540 parts of formaldehyde solution with a concentration of 37%, 322 parts of urea (agricultural grade in purity), 90 parts of melamine (industrial grade in purity), 1.6 parts of polyvinyl alcohol (industrial grade in purity), 0.3 parts of dicyandiamide (industrial grade in purity) class).

[0053] 2. Glue making process

[0054] Put 540 parts of formaldehyde with a concentration of 37% and 1.6 parts of polyvinyl alcohol into the reaction kettle, start the agitator, start to heat up, stop heating when the temperature rises to 38-40°C, and when the temperature inertia rises to 45°C, use 31 ~36% hydrochloric acid to adjust the pH value to 2.0;

[0055] When the temperature rises to 45°C, evenly add 115 parts of the first batch of urea, and control the temperature to rise to 67-70°C;

[0056] Immediately use 25-30% sodium hydroxide aqueous solution to adjust the pH to 3.8, add 9 parts of melamine, stir evenly, add the second batch of ure...

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Abstract

The invention discloses modified urea-formaldehyde glue for a base material laminated board of a laminated solid wood floor. The modified urea-formaldehyde glue is prepared from the following raw materials in parts by weight: 520 to 580 parts of formaldehyde solution with weight concentration of 37%, 300 to 360 parts of urea, 70 to 120 parts of melamine, 1 to 3 parts of polyvinyl alcohol, and 0.1 to 0.5 part of accelerant, wherein the accelerant is hexamine, dicyandiamide, or a mixture of both. The production process includes three steps in sequence, namely, a strong acid step, a weak acid step, and a weak base step. The modified urea-formaldehyde glue is small in formaldehyde emission content, high in laminating strength, and low in production cost, and meets various performances as specified by LY / T 1738-2008.

Description

technical field [0001] The invention belongs to the field of modified urea-formaldehyde resin adhesives, and in particular relates to a modified urea-formaldehyde adhesive for solid wood composite floor substrate composite boards and a production method thereof. Background technique [0002] my country is a big producer of wooden flooring in the world. From 2009 to 2012, the national wooden flooring output reached 380-400 million square meters per year, of which solid wood flooring only accounted for 10%, and the remaining 90% relied on wood-based panels (high-density fiberboard and multi- Layer composite board) as the base material and are called laminate flooring and multi-layer solid wood composite flooring. Since the performance (strength, water resistance, life) of multi-layer solid wood composite board is better than that of high-density fiberboard, the output of multi-layer solid wood composite floor is made of multi-layer solid wood composite board as the base materia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J161/32C08G12/40
Inventor 张运明殷亚庆刘幽燕张友全
Owner GUANGXI UNIV
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